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A high-level overview of wafer-level debonding options and considerations As emerging technologies require ultrathinned device wafers, traditional debonding processes can pose some challenges. Photonic debonding is an innovative debonding process utilizing a carrier coated with an inorganic metal release layer that aids in the release of the thinned wafer from the carrier substrate with…
Click Here to Read MoreRolla, Missouri – Sept. 3, 2018 – Brewer Science, Inc. today, from SEMICON Taiwan 2018, introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging…
Click Here to Read MoreNoted author and futurist Ray Kurzweil wrote back in 2001, "We won’t experience 100 years of progress in the 21st century — it will be more like 20,000 years of progress. . . ." From the invention of the first integrated circuit in 1958, technology has evolved at an unbelievable rate, and, as Kurzweil suggests, that won't…
Click Here to Read MoreHow Temporary Bonding Works Learn how temporary bonding and ultra-thin wafers are being used to create smaller and faster electronic devices. Check out our temporary bonding materials here
Click Here to Read MoreWhy do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and packaging steps. Thinning the wafers before the chips are packaged allows for thinner electronic devices and overall better performance Check out our temporary bonding materials…
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