Brewer Science has the expertise and material portfolio to successfully navigate the entire thin wafer handling process. Our unique proprietary materials, including the WaferBOND® and BrewerBOND® material suites, enable completion of the complex back-end processing of ultrathin wafers with standard semiconductor equipment. These materials allow the wafers to be processed using standard lithographic, passivation, and metallization techniques and tooling.
Temporary Bonding Materials