Dr. Terry Brewer’s discovery of anti-reflective coatings resulted in a revolution in the global microelectronics industry and ushered in today’s high-speed, lightweight electronic devices.
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International Microprocesses and Nanotechnology Conference (MNC 2022) Dr. Douglas Guerrero will present, Patterning Concepts Using Ultrathin Layers in Symposium A: Emerging Breakthroughs in Materials, Processes and Equipment for Advanced Lithography (Litho Breakthrough Symposium) at The 35th International Microprocesses and Nanotechnology Conference (MNC 2022) in Tokushima, Japan on November 8th through 11th. Dr. Guerrero's presentation will…
Click Here to Read MoreAs the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Jakub Kosa will be presenting, High-temperature stable spin-on carbon materials for advanced pattern transfer applications. Yichen Liang will be presenting, Realization of sub-30 pitch EUV Lithography through the application of functional spin-on glass. Learn…
Click Here to Read MoreWhen faced with a difficult problem, it’s hard to know which way to go. Technology and semiconductor manufacturing certainly have their fair share of challenges. The biggest one (or at least the most recurring) is that demand for smaller and smaller feature sizes is greater than our ability to manufacture them. There’s always the quick…
Click Here to Read MoreDeveloping photosensitive film layers to produce features of targeted sizes is a critical process step within any photolithography application. Application engineers have created several processes for performing this step with tank immersion (that is, a bath) and/or several adaptations of spin developing a single wafer to make patterns of features based on film areas of…
Click Here to Read MoreIn its constant quest to innovate, Brewer Science is continually on the cutting edge of what is next. We are currently combining directed self-assembly (DSA) and lithography to achieve sub–10 nm nanostructures. DSA uses block copolymers to generate arrays of self-assembled shapes such as lines or cylinders; the spatial arrangements of the resulting features can…
Click Here to Read MoreLight is energy. It’s a simple statement that holds almost unfathomable implications. The earth and its inhabitants as we know them would not exist without the power of light. It warms the planet and is a crucial element of weather and climate. It fuels our entire food chain and is key to the process that…
Click Here to Read MoreThe race to advance front-end lithography has seen previously insurmountable roadblocks become some for the industry’s greatest achievements. Brewer Science has been a market leader in advanced lithography breakthroughs starting with the invention of bottom anti-reflective coatings in 1981. Today, Brewer Science maintains a broad array of materials to meet the industry’s needs as we…
Click Here to Read MoreRichard Feynman, who won the Nobel Prize in Physics in 1965, gave a famous lecture titled “There's Plenty of Room at the Bottom.” Today’s microelectronics process engineer, in the context of conventional top down lithography, would find it difficult to accept this statement without a long list of caveats. Aggressive scaling demands for newer generations…
Click Here to Read MoreTo the average consumer, the path of new technology looks pretty linear. A cool new concept emerges, scientists figure out how to manufacture it, and pretty soon consumers can find it in a product. But people who work in technology know that’s hardly ever the case. On September 9th, Darron Jurajda, the Brewer Science Semiconductor…
Click Here to Read MoreDirected self-assembly (DSA) refers to the integration of block copolymer (BCP) materials that undergo phase separation with traditional manufacturing processes. With DSA, nanoscale dimensions are achieved at a drastically reduced cost by novel material designs without additional equipment upgrades. Alternative lithographic approaches to achieve features ≤10 nanometers in size typically involve higher equipment budgets or…
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