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Computex

May 30-June 3, 2017 Taipei Since 1981, COMPUTEX TAIPEI (also called COMPUTEX), has been the world’s leading B2B ICT/IoT (Internet of Things) trade show and developing into a global startup platform. While evolving in sync with global ICT industry trend, COMPUTEX 2017 positions itself as Building Global Technology Ecosystems, focusing on 5 main themes: AI…

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CS Mantech

May 22-25, 2017 Indian Wells, CA [Palm Springs]     Booth: 315 CS Mantech: Compound Semiconductor Manufacturing Technology Hyatt Regency Indian Wells Resort & Spa Featured products at CS Mantech: BrewerBOND® 220 Material BrewerBOND® 305 Material BrewerBOND® 510 Material BrewerBOND® 701 Material WaferBOND® HT-10.10 Material WaferBOND® CR-200 Material Schedule a time or ask a question…

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Strategic Materials Conference Korea (SMC)

May 18, 2017 Seoul, Korea   Strategic Materials Conference Korea (SMC Korea) 2017 Diamond Room, B1, InterContinental Seoul The 2nd Strategic Materials Conference (SMC) Korea 2017 will be held with a theme of "Scaling Challenges – The Future of Materials". The conference will cover: Material Challenges in Future Memory Market Forecast EUV, Cleaning and Packaging…

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Critical Materials for Semiconductor Device Mfg (CMC) 2017

May 11-12, 2017 Richardson, Texas   About CMC: The Critical Materials Council (CMC) Conference is a two day event providing actionable information on materials and supply-chains for current and future semiconductor manufacturing. Conference speakers provide information on critical materials used in HVM fabs and look at manufacturing integration issues associated with new materials needed for…

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SEMICON SEA (Southeast Asia) 2017

April 25-27, 2017 Penang, Malaysia     SEMICON SEA (Southeast Asia) 2017: Semiconductor, Wafer-Level Packaging SPICE Arena   Ram is presenting at the Advanced Packaging forum Wednesday, April 26: "Temporary Bonding Technologies for Advanced Fan-Out Wafer Level Packaging Applications" 16:20-16:45, Mr. Ramachandran K. TRICHUR, Director, Business Development, Brewer Science Inc, USA   Schedule a time…

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VLSI-TSA Symposium 2017

April 24-27, 2017 Hsinchu,Taiwan. VLSI-TSA Symposium Ambassador Hotel Hsinchu, Taiwanj The 2017 International Symposium on VLSI Technology, Systems and Applications (2017 VLSI-TSA) will be held on April 24-27, 2017 at the Ambassador Hotel Hsinchu,Taiwan. Organized by Industrial Technology Research Institute (ITRI) and technically co-sponsored by IEEE, VLSI-TSA creates an annual platform for technical exchanges by experts…

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Advanced Packaging & System Integration Technology Symposium (Yole & NCAP) 2017

April 20-21, 2017 Wuxi, China   The Advanced Packaging Symposium is hosted and organized by Yole Développement and the National Center for Advanced Packaging (NCAP China). All aspects of Advanced Packaging, including Fan Out Packaging, System in Package, Advanced Substrates, 3D Technology & Embedded Technologies, as well as MEMS & Sensors packaging, RF, and Photonics…

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