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Brewer Science Unveils BrewerBOND® Dual-Layer Temporary Bonding System and BrewerBUILD™ Material for RDL-First Fan-Out Packaging

Rolla, Missouri – Sept. 3, 2018 – Brewer Science, Inc. today, from SEMICON Taiwan 2018, introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging…