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February 28- March 2, 2017 San Jose, California Booth: 110 Molecular force modeling of lithography - Invited Paper Zhimin Zhu, Brewer Science, Inc. (United States) Session 4: 3D Resist Effects and Modeling Tuesday, February 28th 2017 4:10 - 6:00 PM Location: Convention Center 220C Highχ block copolymers for directed self-assembly patterning without the need for…
Click Here to Read MoreFebruary 13, 2017 – Tokyo, Japan – Brewer Science invites you to join them February 15 through February 17 at Printable Electronics Japan 2017, a part of the Converting Technology Exhibition, as the company showcases original sensor technology products created and manufactured at Brewer Science. This exhibition is focused on accelerating innovation and solutions found…
Click Here to Read MoreFebruary 10, 2017 – San Jose, CA – Brewer Science invites you to join us February 26 through March 2 at SPIE Advanced Lithography in San Jose, CA, as we showcase original technology products created and manufactured at Brewer Science. Attendees will have the opportunity to learn more about the Brewer Science suite of lithography…
Click Here to Read MoreProTEK® Materials Highly oleophobic and hydrophobic transparent scratch-resistant coating.
Click Here to Read MoreWhy do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and packaging steps. Thinning the wafers before the chips are packaged allows for thinner electronic devices and overall better performance Check out our temporary bonding materials…
Click Here to Read MoreWhat is "Fan-out Wafer-Level Packaging"? Fan-out wafer-level packaging (FOWLP) has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and ease of integration using conventional wafer fab equipment. In this video, Ram Trichur describes a typical FOWLP process flow and the challenge of handling the…
Click Here to Read MoreFebruary 15- 17, 2017 Tokyo, Japan Brewer Science is co-exhibiting with OE-A (Organic and Printed Electronics Association). Booth: 6B-28 Conference Website
Click Here to Read MoreJanuary 19, 2017 – Belle, MO – Brewer Science is investing in the innovators of tomorrow by promoting opportunities for learning more about science, technology, engineering, and math (STEM) in the elementary schools located in Vienna and Belle, MO. Teaming up with several local teachers, Brewer Science’s intern program recently hosted a Steak Dinner and…
Click Here to Read MoreNew Report by President’s Council of Advisors on Science and Technology Reinforces Need for Greater Competition with China January 17, 2017 – Rolla, MO - Brewer Science is supporting the findings in a new report outlining long-term solutions for continued U.S. leadership in the global semiconductor industry. Brewer Science, a national and global leader in…
Click Here to Read MoreJanuary 8-11, 2017 Half Moon Bay, California Brewer Science is proud to sponsor two sessions at the 2017 SEMI ISS. The first is the keynote session entitled ‘Data Center: Innovation, Opportunity and Growth’ on Tuesday, January 10th beginning at 8:00 AM and the second is Session 3 on 'Technology' which will immediately follow the keynote…
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