Publications

Si Li, Joyce Lowes, Ruimeng Zhang, Ming Luo, Kelsey Brakensiek, Veerle Van Driessche, Douglas J. Guerrero, ","

Douglas Guerrero, "Roles of Underlayers in Resist and Underlayer Roadmap for EUV Lithography," Fujifilm Advanced Lithography Workshop,

Yichen Liang, "Realization of sub-30 pitch EUV Lithography through the application of functional spin-on glass," SPIE Advanced Lithography,

Jakub Koza, "High-temperature stable spin-on carbon materials for advanced pattern transfer applications," SPIE Advanced Lithography,

Rama Puligadda, "New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging," CMC Conference,

Yichen Liang, "Application of spin-on-glass underlayer on printing high-resolution line/space and contact hole patterning using extreme ultraviolet lithography," SMC (Strategic Materials Conference) Korea 2022,

Luke Prenger, "Photonic Debond: Scalability and Advancements ," Electronic Components and Technology Conference (ECTC),

Ryan Moss, William Stone, "Unlocking the Future of IIoT Condition Monitoring: Integrated FHE Systems,"

Runhui Huang, Xing-fu Zhong, Gu Xu, Boyu Zhang, Jakub Koza, Sean Simmons, "Development of planarizing spin-on carbon material for high-temperature processes," Semicon China 2021 (CSTIC), March 2021,

Wenkai Cheng, Yubao Wang, Debbie Blumenshine, Xiao Liu, Dongshun Bai, and Rama Puligadda, "A Novel Multifunctional Single-Layer Adhesive Used for both Temporary Bonding and Mechanical Debonding in Wafer-Level Packaging Applications," Semicon China 2021 (CSTIC), March 2021,

Runhui Huang, Xing-Fu Zhang, Carissa Jones, Jakub Koza, Sean Simmons, "High-Temperature-Stable, Spin-On Carbon Materials for High-Aspect-Ratio Gap-Fill Applications," 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), May 2021,

Luke Prenger, Xiao Liu, Xavier Martinez, Rama Puligadda, Vikram Turkani, Vahid Akhavan and Kurt Schroder, "Advancements of Temporary Bond and Debond: Creating Photonic Debond Methods and Materials for Wafer-Level Packaging," IMAPS 2021, April 12, 2021,

Baron Huang, Duo Tsai, Xiao Liu, Rama Puligadda, "A Novel Photosensitive Permanent Bonding Material for Polymer/Metal Hybrid Bonding," IMAPS 2021, April 12, 2021,

Rachel Cartaya, Arthur Southard, Dongshun Bai, John Massey , "A Low Tg Bonding Material for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes ," IMAPS 2021, April 12, 2021,

Yu-Min Lin, Sheng-Tsai Wu, Wei-Lan Chiu, Chao-Jung Chen, Tao-Chih Chang, Hsiang-Hung Chang, Chia-Hsin Lee, Xiao Liu, Chang-Chun Lee, "A novel multi-chip stacking technology development using a flip-chip embedded interposer carrier integrated in fan-out wafer-level packaging," Electronic Components and Technology Conference (ECTC) 2021, 2021,

Koen Kennes, Alain Phommahaxay, Alice Guerrero, Olga Bauder, Samuel Suhard, Pieter Bex, Xiao Liu, Thomas Schmidt, Gerald Beyer and Eric Beyne, "Acoustic modulation during laser debonding of collective hybrid bonded dies ," Electronic Components and Technology Conference (ECTC) 2021, 2021,

Chia-Hsin Lee, Xiao Liu, Luke Pregner, Kim Arnold, Yu-Min Lin, Wei-Lan Chiu, Chao-Jung Chen, and Kuan-Neng Chen, "Versatile laser release material development for chip-first and chip-last fan-out wafer-level packaging," Electronic Components and Technology Conference (ECTC) 2021, 2021,

Xiao Liu, Yubao Wang, Debbie Blumenshine, and Rama Puligadda, "A Single-Layer Mechanical Debonding Adhesive for Advanced Wafer-Level Packaging," IEEE Electronic Components and Technology Conference (ECTC), 2021,

Shyam Paudel, Douglas Guerrero, Kayode Ajayi, Tim Limmer, Thomas Parson, Aiwen Wu , "Characterization and Reduction of Post-Litho and Post-Etch Defectivity in Advanced Si Hardmask Material," Advances in Patterning Materials and Processes XXXVIII, February 2021,

V. Dall'Astaa, E. Litterioa, N. Corneoa, J. Kozab, J. Jeauneaub, T. F. Bellunatoa, "2.0 semiconductors manufacturing: yield improvement by tuning underlayer chemistry," 2020,

P U Ashvin Iresh Fernando, Gilbert K. Kosgei, Erik Alberts, Anton Netchaev , Jason D Ray, David Henderson, Keith Conley, Rishi Patel, Jonathan Fury and Lee C. Moores, "A Simple, Cost-Effective Electrochemical Sensor for Detection of Cu2+ In an Aquatic Environment,"

Dongshun Bai, "Material Advancement for Heterogenous Integration," 2019,

Douglas Guerrero, Nick Brekensiek, James Lamb, Mary Ann Hockey, Daniel Sweat, Richard Daugherty, "EUV & DSA: Complementary Technologies for Future Nodes," 26th International Conference of Photopolymer Science and Technology, June 25-27, 2019,

Dr. Vijaya Kayastha, "Role of Materials In Performance of Printed Temperature Sensors," Sensors Expo and Conference, June 25-27, 2019,

Alice Guerrero, Kim Yess, Kim Arnold, A. Podpod, A. Phommahaxay, P. Bex, J. Slabbekoorn, J. Bertheau, A Salahouelhadj, E Sleeckx, A. Miller, G. Beyer, E Beyne, "Advances in Temporary Carrier Technology for High Density Fan-Out Build-Up," 70th IEEE Electronic Components and Technology Conference (ECTC), May 28-31, 2019,

Dr. Urlich Herleb, "Industry 4.0 - Real Time Warehouse Condition Monitoring," ID Tech X Europe 2019 , April 11, 2019, pp. Unnumbered

Tony Flaim and Jennifer See, "New Structural Plastics for Flexible Hybrid Electronics Fabrication," Chip Scale Review, May/June 2019, pp. 11-14

Dongshun Bai, "Dual-Layer Temporary Bonding System for Advanced Packaging," NCAP - Yole Developpment Symposium, April 22, 2019,

Zhimin Zhu, "Thin Film Characterization for advanced Patterning," CSTIC 2019 (SEMICON China), March 19, 2019,

Dan Sullivan, "Tailoring Material and Process Variables to control Planarization at 7-nm Nodes," CSTIC 2019 (SEMICON China), March 19, 2019,

K. Sakayuvi, "ACE: A New Chemo-Epitaxy Process Based on Spacer Patterning," SPIE, February 27, 2019,

Matthew Koch, Elisabeth Brandl, Thomas Uhrmann, Mariana Pires, Stefan Jung, Julian Bravin, Jurgen Bruggraf, Mathias Pichler, "Temporary and Permanent Bonding Enables 3D Integration of Ultrathin Wafers," IMAPS, January 2019,

Mary Ann Hockey, Nick Brakensiek, Kui Xu, Richard Daugherty, "An Alternative Line-Space Shrink EUVL Plus Complementary DSA Lithography," SPIE Journal, June 3, 2019, pp. Unnumbered

Xiao Liu, Baron Huang, Hong Zhang, Lisa Kirchner, Arthur Southard, Rama Puligadda, and Tony Flaim, "A Versatile Fan-Out Infastructure Based on Die-Stencil Substrate Promoted by an Advanced Multifunctional Temporary Bonding Material," 70th IEEE Electronic Components and Technology Conference (ECTC), May 28-31, 2019,

Michelle R. Fowler, John P. Massey, Tanja Braun, Steve Voges, Robert Gernhardt, Markus Wohrmann, "Investigation and Methods Using Various Release and Thermoplastic Bonding Materials to Reduce Die Shift and Wafer Warpage for eWLB Chip-First Processes," 70th IEEE Electronic Components and Technology Conference (ECTC), May 28-31, 2019,

Zhimin Zhu, Shawn Ye, Joyce Lowes, Sean Simmons, Catherine Frank, Tim Limmer, James Lamb, "Thin-Film Characterization for Advanced Patterning," SPIE Advanced Lithography 2019, February 26, 2019,

Luke Pregner, Xiao Liu, Qi Wu, Rama Puligadda, "Material Design Advancements Create Multifunctional Materials for Single-Layer Temporary Bonding and Debonding," IMAPS, March 6, 2019,

Ryan Giedd, Jonathan Fury, Dan Brewer, William Stone, "AI Needs Printed Electronics for Sensor Networks," FLEX 2019, February 20, 2019,

Ryan Giedd, Rishi Patel, Suresh K. Sitaraman, "Printed Flexible Electronic Devices: Signal Interface and Reliability Assessment," FLEX 2019, February 18, 2019,

Tony Flaim, Gu Xu, and Jennifer See, "Novel, Fast-Etching Plastic Packaging Materials for Laser Processing of Flexible Circuits and Printed Electronics," FLEX 2019, February 20, 2019,

Xiao Liu, Dongshun Bai, Lisa Kirchner, Rama Puligadda, Tony Flaim, "Advanced Multifunctional Temporary Bonding Materials with Heterogeneous Integrated Properties for Various Advanced Packaging Applications," CSTIC 2019 (SEMICON China), March 18-19, 2019,

Dongshun Bai, Doyle Edwards, "Advanced Packaging Workshop," WLP - China Workshop, November 23, 2018,

Dongshun Bai, "Temporary Wafer Bonding Technology for Advanced Packaging," EPTC 2018 (IEEE 20th Electronics Packaging Technology Conference), December 6, 2018,

Jay Su, Xiao Liu, Luke Pregner, Chia-Hsin Lee, Yu-Min - Lin, Sheng-Tsai Wu, Chun-Min Wang, Shin-Yi Huang, Ang-Ying Lin, Tao-Chih Chang, Puru Bruce Lin, Cheng-Ta Ko, Yu-Hua Chen, Kuan-Neng Chen, "An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications," ECTC 2018 (IEEE 69th Electronic Components and Technology Conference, May 29, 2018,

Michelle Fowler, Christopher Apanius, Kimberly Yess, "High Temperature Survivability and the Processes it Enables," Chip Scale Review, November/December 2018, pp. 14-17

Dongshun Bai, "New Bonding and Laser Release Materials for Advanced Packaging," China Semiconductor Packaging and Testing Conference (CSPTC 2018), November 20, 2018,

Luke Pregner, Qi Wu, Aruthur Southard, Debbie Blumenshine, Rama Puligadda, "Significant Advancement In Laser Ablative Release Layer Material Design Enabling Low Energy and Low-Residue Debond," IWLPC, October 24, 2018,

Dongshun Bai, "Temporary Wafer Bonding Technology for Advanced Packaging," EPTC 2018 (IEEE 20th Electronics Packaging Technology Conference), December 4-7, 2018,

Michelle Fowler, Seth Molenhour, Phillip Tyler, Laura Mauer, "Temporary Bonding and the Challenge of Cleaning Post-Debond," IWLPC, October 2018,

Douglas Guerrero, Nick Brekensiek, James Lamb, Mary Ann Hockey, Kui Xu, Richard Daugherty, "EUV & DSAL Complementary Technologies for N5 Node and Beyond," FFEM Lithography Workshop, September 13-14, 2018,

James Lamb, Mary Ann Hockey, Nick Brakensiek, Kui Xu, Richard Daugherty, "The Marriage of DSA with EUVL: Leveraging the convergence of these technologies to achieve 5 nm and beyond," SEMICON Taiwan 218, August 27, 2018,

Michelle Fowler, John P. Massey, Mattew Koch, Kevin Edwards, Tanja Braun, Steve Voges, Robert Gernhardt, Markus Wohrmann, "Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes," IMAPS, October 8-12, 2018,

Bruce Johnson, "Using Printed Electronics Sensor Systems to Protect Groundwater," Printed Electronics Now, July 24, 2018, pp. Unnumbered

Tim Limmer, "Plan for Success with a Failure Mode and Effects Analysis and Control Plan," Semiconductor Engineering, July 12, 2018,

Dongshun Bai, "The Advancement of Carrier-Assisted Substrate Handling Technology for Advanced Packaging," NCAP-Yole Developpment 2018, June 21, 2018,

Alice Guerrero, Dongshun Bai, Kim Arnold, "Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-Up," ECTC (IEEE 68th Electronics Components and Technology Conference), May 29, 2018,

Kim Yess, "Material Innovations for Advancements in Fan-out Packaging," Solid State Technology Magazine, April/May 2018, pp. Unnumbered

Wu-Sheng Shih, John K. Bledsoe, Dan Janzen, Chris Cox, Qihua Wu, Stephen Gibbons, Doyle Edwards, Christopher Landorf, "Advancing Sustainable Manufacturing of Carbon Nanomaterials and Devices through Life Cycle Assessment," TechConnect WORLD 2018, May 16, 2018,

Mark A. Chappel, Wu-Sheng Shih, Lesley Miller, Brooke Stevens, John K. Bledsoe, William Stone, Chris Cox, Dan Janzen, Stephen Gibbons, Rishi Patel, Alan J. Kennedy, Jon Brame, Matthew Brondum, Stephen A. Diamond, Jessica Coleman, Doyle Edwards, Jeffery A. Steevens, "Identifying Potential Environmental Impacts of Carbon Nanotube-Based Printed Electronic Sensor Platforms," Printed Sensor LDA - LOPEC, March 2018,

Nickolas Brakensiek, Kui Xu, Daniel Sweat, Mary Ann Hockey, "Optimized Plasma Etch Window of Block Copolymers and Neutral Brush Layers for Enhanced Direct Self-Assembly Pattern Transfer into a Hardmask Layer," SPIE, March/April 20, 2018,

Alice Guerrero, Dongshun Bai, Kim Arnold (Alain Phommahaxay, Arnita Podpod, John Slabbekoorn, Erik Sleeckx, Gerald Beyer, Eric Beyne, "Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-Up," ECTC (IEEE 68th Electronics Components and Technology Conference), May 29, 2018,

Hong Zhang, Xiao Liu, Shawna Rickard, Rama Puligadda, Tony Flaim, "Novel Temporary Adhesive Materials for RDL-First Fan-Out Wafer-Level Packaging," ECTC (IEEE 68th Electronics Components and Technology Conference), May 29, 2018,

Kui Xu, Eric Calderas, Mary Ann Hockey, Douglas Guerrero, "Straightforward directed self-assembly process flows enabled by advanced material," SPIE Advanced Lithography, February 28, 2018,

Michelle Fowler, John P. Massey, Ramachandran K. Trichur, Matthew Koch, "Dual-Carrier Process Using Mechanical and Laser Release Technologies for Advanced Wafer-Level Packaging," ECTC Conference, May 29, 2018,

Ramachandran K. Trichur, Rama Puligadda, and Tony D. Flaim, "Sacrificial Laser Release Materials for RDL-First Fan-Out Packaging," Chip Scale Review, March/April 2018, pp. 10-16

Dominic Miranda, "Printed Carbon Nanotube Sensor for Gas Detection," 2018 FLEX - Sensors and Power, February 15, 2018,

Shelly Fowler, Seth Molenhour, Laura Mauer, Phillip Tyler, "Temporary Bonding and the Challenge of Cleaning Post-Debond," IMAPS, October 23-26, 2018,

Ramachandran K. Trichur, "3D InCites' 2018 Outlook for Advanced Packaging Materials," 3DIncites 2018 Outlook, January 12, 2018,

Alvin Lee, Jay Su, Kim Arnold, Jim-Wein Lin, Puru Lin, Cheng-Ta Ko, Yu-Hua Chen, Wen-Wei Shen, Yu Min Lin, "Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level-Packaging," ECTC (IEEE), May/June 29, 2018,

Darin Collins, "Defect Reduction Requirements for Future Nodes," Silicon Semiconductor Magazine, March 2018, pp. Unnumbered

Dongshun Bai, Xiao Liu, Hong Zhang, Ram Trichur, Rama Puligadda, and Tony Flaim, "Laser Release Technology for Wafer Level Packaging," CSTIC 2018, March 11-12, 2018,

Zhimin Zhu, Amanda Riojas, Trisha May, "High-Fidelity Lithography Against Stochastic Effects," Optical Microlithography (SPIE 2018), March 20, 2018,

Kui Xu, Eric Calderas, Mary Ann Hockey, Douglas Guerrero, Richard Daugherty, Yichen Liang, "Straightforward directed self-assembly process flows enabled by advanced material," SPIE, March 13, 2018,

Ramachandran K. Trichur, "Temporary Bonding Processes For Fan-Out Packaging," EPTC 2017 - 19th Electronics Packaging Technology Conference, December 6-9, 2017,

Kim Yess, "The Evolution of Substrate Build-Up and Thin Wafer Handling," 3D ASIP Conference 2017, December 5, 2017,

Alan Kennedy, Stephen Diamond, Jonathon Brame, Taylor Rycroft, Jessica Coleman, Nick Melby, Mark Ballentine, Mark Chappell, Wu-Sheng Shih, Viral Panchal, "Properties and hazard uncertainty are bigger than size: insights from a tiered framework for advanced (and nano-enabled) materials," SETAC 2017, November 12-16, 2017,

Dominic Miranda, "Printed Sensors and the Industrial IoT: Sensing Where No Sensor Has Gone Before," OPE Journal, November 21, 2017, pp. Unnumbered

Ramachandran K. Truchur, Tony D. Flaim, "Evolution of Temporary Bonding Technology to Address Challenges in Advanced Semiconductor Packaging Applications," Chip Scale Review, October 2017,

Cristina Matos-Perez, Deborah Blumenshine, Lisa Kirchner, Tony Flaim, Rama Puligadda, "Ablative Laser Patterning of Polymeric Dielectric Materials," IMAPS Symposium 2017, October 11, 2017,

Chris Cox, "Solving Smart Clothing Design Challenges with Printed, Flexible Sensor Technology," EDN Magazine, November 15, 2017, pp. Unnumbered

Louis McCarthy, Alex Johnson, N. Anthony, "Sensor Excitation and Measurement Techniques for CNT Thin-Film Sensors," I3S 2017 - 5th International Symposium on Sensor Science, September 29, 2017,

Mary Ann Hockey, "Easing DSA process Requirements for High-Throughput Manufacturing," 3rd International DSA Symposium, September 18, 2017,

Joyce Lowes, Reuben Chacko, Jinhu Dai, Douglas Guerrero, "Surface Modification and Selective Deposition," FFEM Advanced Lithography Workshop, September 12-15, 2017,

Jonathan Jeanueau, "Advanced Planarization," FFEM Advanced Lithography Workshop, September 14, 2017,

Xiao Liu, Qi Wu, Jayson Cooper, Kuo Han, Dongshun Bai, Matt Koch, Rama Puligadda, Tony Flaim, "The Thermocure System As a Technical Enabler For Wafer-Level Packaging Applications," IWLPC, October 24-26, 2017,

Qi Wu, Xiao Liu, Kuo Han, Dongshun Bai, and Tony Flaim, "Temporary Bonding and Debonding Technologies for Fan-out Wafer-Level Packaging," 3DInCites (IEEE), August 2017,

James Lamb III, "Extending Lithography with Advanced Materials and Manufacturing Excellence," SEMICON Taiwan, September 13-16, 2017,

Tony Flaim, "New Enabling Materials for Fan-out Wafer-Level Packaging," SEMICON Taiwan, September 13-16, 2017,

Douglas Guerrero, "DSA and EUV: Complementary Technologies to Enable Fine-Pitch Lithography," Solid State Technology Magazine, July 2017, pp. Unnumbered

Gu Xu, "Gelatin Mediated Polymerization of Styrene in Emulsion-Based Gels," ACS National Meeting, August 20-24 20-24, 2017,

Ramachandran K. Truchur, Tony D. Flaim, "Process Challenges for Temporary Bonding Materials in Fan-out Packaging," 2017 Chip Scale Review, May/June 2017, pp. 14-19

Austin Shearin, "Highly Near-Infrared-Sensitive, Printed Flexible Thermistors," Flex 2017, June 19-22, 2017,

Ramachandran K. Trichur, Molly Hladik, Jayson M. Cooper, "Temporary Bonding for Backside Processing of 150-mm SiC Wafers," CSMantech Online Digest, May 16-19, 2016, pp. 113

Alex Bruce Johnson, "Mechanism and Application of Resistive Flex Sensors," Sensors Midwest, September 28, 2016,

Darron Jurajda, "DSA: How far have we come and how much further is left to go?," SEMICON Taiwan, September 7-9, 2016,

X. Chevalier, P. Coupillaud, G. Lombard, C. Nicolet, J. Beausoleil, G. Fleury, M. Zelsmann, P. Bezard, G. Cunge, J. Berron, K. Sakavuyi, A. Gharbi, R. Tiron, G. Hadziioannou, C. Navarro, I. Cayrefourcq, "Design of New Block Copolymer Systems to Achieve Thick Films with Defect-Free Structures for Applications of DSA into Lithographic Large Nodes," SPIE, March 25, 2016,

Alvin Lee, Jay Su, Xiao Liu, Yu-Po Hung, Yu-Min Lin, Shin-Yi Huang, Ren-Shin Cheng, Tao-Chih Chang, "Temporary Bonding and Debonding Technologies to Enable Innovative Fan-Out Embedded Interposer for High-Density Applications," IMPACT, October 26-28, 2016,

Alain Phommahaxay, Goedele Potoms, Greet Verbinnen, Erik Sleeckx, Gerald Beyer, Eric Beyne, Alice Gurrero, Dongshun Bai, Xiao Liu, Kim Yess, Kim Arnold, Walter Spiess, Tim Griesbach, Thomas Rapps, and Stefan Lutter, "Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of Temporarry Bonding Material," Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, May 31, 2016,

Alvin Lee, Jay Su, Baron Huang, Ram Trichr, Dongshun Bai, Xiao Liu, "Optimization of laser release layer, glass carrier, and organic build-up layer to enable RDL-first-fan-out wafer-level packaging," IMAPS 2016 - 49th International Symposium on Microelectronics, October 10-13, 2016,

Ramachandran K. Trichur, Tony D. Flaim, "Evolution of temporary bonding technology for advacned semiconductor packaging," Chip Scale Review, September/October 2016, pp. 12-18

Xiao Liu, Qi Wu, Dongshun Bai, Trevor Stanley, Alvin Lee, Jay Su, Baron Huang, "Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing," IMAPS 2016 - 49th International Symposium on Microelectronics, October 10-13, 2016,

Zhimin Zhu, Joyce Lowes, Vandana Krishnamurthy, Dan Sullivan, "Investigation of chemical effects in lithography," Semiconductor Technology International Conference (CSTIC), March 13-14, 2016,

Anne Jourdain, Alain Phommahaxay, Dimitrios Velenis, Alice Guerrero, Dongshun Bai, Kim Yess, Kim Arnold, Andy Miller, Kenneth Rebibis, Gerald Byer, Eric Beyne, "Single-release-layer process for temporary bonding applications in the 3D integration area," Proceedings of the IEEE Electronic Components and Technology Conference (ECTC), 2015, pp. 893-898

Ramachandran K. Trichur , Tony D. Flaim, "Temporary bonding and thin wafer handling strategies for semiconductor device processing," Chip Scale Review, November-December 2015, pp. 38-41

Wen-Wei Shen , Hsiang-Hung Chang , Jen-Chun Wang , Cheng-Ta Ko , Leon Tsai , Bor Kai Wang , Aric Shorey , Alvin Lee , Jay Su , Dongshun Bai , Baron Huang , Wei-Chung Lo , Kuan-Neng Chen, "Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication," IEEE Electronic Components & Technology Conference (ECTC), 2015, pp. 1652-1657

Ren-Shin Cheng , Shin-Yu Huang , Yu-Min Lin , Yin-Po Hung , Xiao Liu , Jay Su , Alvin Lee , Tao-Chih Chang, "Temporary bonding and debonding technologies to enable innovative fan-out embedded interposer for high-density applications," IMAPS International Symposium on Microelectronics, Fall 2015, October 26-29, 2015, pp. 1-6

Hsiang-Hung Chang , Chun-Hsien Chien , Wen-Wei Shen , Aric Shorey , Leon Tsai , Bor Kai Wang , Dongshun Bai , Kim Arnold , Jay Su , Alvin Lee , Jen-Chun Wang, "A novel thin wafer handling technology to enable cost-effective fabrication of through-glass-via interposers," IMAPS 47th International Symposium on Microelectronics, 2014, pp. [paper WP44]

Stephen Gibbons , Dan Janzen , Mark Chappell , Jeffery Steevens , Doyle Edwards , Wu-Sheng Shih, "Outwitting the uncertainty of nanotechnology risks through environmental life cycle assessment," Nanotech 2014, 2014, pp. 113-114

Dan Janzen , Kathryn Kremer , Kay Mangelson , Yongqing Jiang , Ram Trichur , Stephen Gibbons , James E. Lamb III, "Advancements in microelectronics-grade carbon nanotube materials for NRAM® device manufacture and analysis of carbon nanotube mass in end user devices," Nanotech 2014, 2014, pp. 194-197

Stephen Gibbons , Jacqueline Garrison , Joshua Alford , Christopher W. Landorf , Wu-Sheng Shih , Benjamin J. Leever , John D. Berrigan, "Extremely flexible and stretchable carbon nanotube composites for conformal electronic devices," Nanotech 2014, 2014, pp. 340-343

Vijaya Kayastha , Stephen Gibbons , Ryan Giedd, "Ultrafast integrated humidity and temperature sensor based on carbon nanotubes, and a sensor controller system," Nanotech 2014, 2014, pp. 1-4

Dan Janzen , Kathryn Kremer , Kay Mangelson , Yongqing Jiang , Stephen Gibbons , James E. Lamb III , John Bledsoe , Mathew Boeser, "Advancement of microelectronics-grade carbon nanotube materials for NRAM® device manufacture," 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2014, pp. 125-129

Kim Arnold , Mark Privett , Susan Bailey , Alice Guerrero , Greet Verbinnen , Alain Phommahaxay , Anne Jourdain , Andy Miller , Kenneth Rebibis , Gerald Beyer , Eric Beyne, "Temporary bonding for high-topography applications: Spin-on material versus dry film," IEEE Electronic Components and Technology Conference (ECTC), 2014, pp. 894-898

Alvin Lee , Jay Su , H.H. Chang , C.H. Chien , Bor Kai Wang , Leon Tsai , Aric Shorey, "Optimization for temporary bonding process in PECVD passivated micro-bumping technology," IEEE Electronics Packaging Technology Conference (EPTC), 2013, pp. 678-681

Mark Privett , Alex Smith , Martin Ivie , Jan Campbell , Roberta Hawkins , Pavan Bhatia , Gary Brand, "Meeting the fabrication challenges for backside processing on thin substrates with ultrahigh device topography," CS MANTECH Online Digest, May 13-16, 2013, pp. 51-54

Jason Neidrich , Mark Privett , Jeremy McCutcheon , Alice Guerrero , Kenneth Rebibis , Andy Miller , Gayle Murdoch , Greet Verbinnen , Alain Phommahaxay , Anne Jourdain , Gerald Beyer , Eric Beyne, "Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications," IEEE Electronic Components and Technology Conference (ECTC), May 28-31, 2013, pp. 113-117

Zhimin Zhu , Michael Weigand , Vandana Krishnamurthy , Daniel Sullivan, "Robust trilayer patterning technique," ECS Transactions, 2013, pp. 251-257

Michelle Fowler, "Bonding material properties from a 3D IC perspective," Chip Scale Review, September-October 2013, pp. 30-33

Christopher Landorf , Wu-Sheng Shih , Carissa Jones , Vijaya Kayastha, "Functionalized carbon nanotube–based sensors for detecting a trace quantity of 2,4-dinitrotoluene explosive vapors, with selectivity," Nanotech 2013, 2013, pp. 268-271

Liyong Diao , James Lamb , Stephen Gibbons , Wu-Sheng Shih , Ryan Giedd, "Decoupled temperature and moisture sensor made of CNT-based nanomaterials on flexible plastic substrates," Nanotech 2013, 2013, pp. 84-87

Yunfeng Ling , Guiru Gu , Runyu Liu , Xuejun Lu , Vijaya Kayastha , Carissa S. Jones , Wu-Sheng Shih , Daniel C. Janzen, "Investigation of the humidity-dependent conductance of single-walled carbon nanotube networks," Journal of Applied Physics, 2013, pp. 024312-1 - 024312-5

Xavier Thrun , Kang-Hoon Choi , Norbert Hanisch , Christoph Hohle , Katja Steidel , Douglas Guerrero , Thiago Figueiro , Johann W. Bartha, "Effects on electron scattering and resist characteristics using assisting underlayers for e-beam direct write lithography," Proceedings of SPIE, 2013, pp. 86820Z-1 - 86820Z-10

Gary Brand , Mark Privett , Aaron Jacobs, "Temporary bonding material total thickness variation (TTV)," International Wafer-Level Packaging Conference (IWLPC) Proceedings, November 5-7, 2013, pp. [unnumbered]

Nick Brakensiek , Michael Sevegney, "Effects of dispense equipment sequence on process start-up defects," Proceedings of SPIE, 2013, pp. 86822A-1 - 86822A-8

Bor Kai Wang, Jeremy McCutcheon, Jay Su, Alvin Lee, Leon Tsai, Aric Shorey, "Optimization of temporary bonding through high-resolution metrologies to realize ultrathin wafer handling," IEEE Electronics Packaging Technology Conference (EPTC), 2012, pp. 322-325

Bor Kai Wang, Leon Tsai, Aric Shorey, Alvin Lee, Jay Su, Jeremy McCutcheon, "Metrologies for characterization of flatness and thickness uniformity in temporarily bonded wafer stacks," International Microsystems, Packaging, Assembly, and Circuits Technology Conference (IMPACT), 2012, pp. 263-266

Tantiboro Ouattara , Carlton Washburn , Aline Collin , Vandana Krishnamurthy , Douglas Guerrero, "Throughput increases using EUV assist layers," ECS Transactions, 2012, pp. 215-218

Tantiboro Ouattara , Carlton Washburn , Aline Collin , Vandana Krishnamurthy , Douglas Guerrero , Michael Weigand, "EUV assist layers for use in multilayer processes," Proceedings of SPIE, 2012, pp. 83222E-1 - 83222E-7

Mary Ann Hockey , Qin Lin , Eric Calderas, "How much further can lithography process windows be improved?," Proceedings of SPIE, 2012, pp. 83280Q-1 - 83280Q-10

Xie Shao , Curt Planje , Michelle Fowler , Dongshun Bai, "High-aspect-ratio planarization using self-leveling materials," IMAPS International Conference and Exhibition on Device Packaging, March 5-8, 2012, pp. 412-415

Andy Miller , Gerald Beyer , Bart Swinnen , Alex Van den Eede , Pieter Bex , Rama Puligadda , Jeremy McCutcheon , Alice Guerrero , Walter Spiess , Peter Bisson , Markus Gabriel , Tobias Woitke , Greet Verbinnen , Anne Jourdain , Alain Phommahaxay , Eric Beyne, "Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding," IEEE International 3D Systems Integration Conference (IEEE 3DIC), January 31-February 2, 2012, pp. 1-4 (paper 1-2)

Rama Puligadda, "Temporary bonding for enabling three-dimensional integration and packaging," Handbook of Wafer Bonding, 2012, pp. 329-345

Joseph Demster , Carissa Jones , Vijaya Kayastha , Cory Horner , Mariana Nelson , James Lamb, "Optimization of carbon nanotube thin-film transistor fabrication," Nanotech 2012, 2012, pp. 240-243

Liyong Diao , Wu-Sheng Shih , James E. Lamb III, "Fabrication and characterization of CNT inductors on flexible plastic substrates," Nanotech 2012, 2012, pp. 213-216

Jeremy W. McCutcheon , Debbie L. Blumenshine , Alvin Lee, "Advanced processes and materials for temporary wafer bonding," IEEE Electronics Packaging Technology Conference (EPTC), 2011, pp. 744-746

Molly Hladik, "Novel chemistry and dispersive techniques for diverse CNT applications," Nanotech 2011: Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, 2011, pp. 547-549

Stephen Turner, "Advancements in ink-jet deposition of carbon nanotube materials for printed electronics," Nanotech 2011: Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, 2011, pp. 558-561

Urs Berger , Maggie Yihong Chen , Ray T. Chen , Dan Pham , Harish Subbaraman , Xuliang Han , Nick L. Downing , Vijaya Kayastha , Wu-Sheng Shih , Carissa S. Jones , Xuejun Lu , Puminun Vasinajindakaw , Runyu Liu , Yunfeng Ling , Guiru Gu , Mike Renn, "All-printed thin-film transistor based on purified single-walled carbon nanotubes with linear response," Journal of Nanotechnology, 2011, pp. article ID 823680, 4 pages

Sumant Sood , Dan Wallace , Mark Privett , Alain Phommahaxay , Thibault Buisson , Anne Jourdain , Peter Bisson , Eric Beyne , Youssef Travaly , Bart Swinnen, "300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications," IEEE International 3D Systems Integration Conference (3DIC), 2010, pp. [unnumbered]

D.J. Guerrero , D.M. Sullivan , Z. Zhu , R.L. Mercado, "Simulation and experimental study on multilayer double-patterning processes," ECS Transactions, 2010, pp. 473-378

J. Lowes , C. Stroud , A. Guerrero , C. Washburn , P. Raj, "Comparative study of photosensitive versus non-photosensitive developer-soluble bottom anti-reflective coating systems," ECS Transactions, 2010, pp. 503-508

Jeremy McCutcheon , Dongshun Bai, "Advanced thin wafer support processes for temporary wafer bonding," IMAPS 2010 - 43rd International Symposium on Microelectronics, 2010, pp. 361-363

JoElle Dachsteiner , Robert Brown , Jeremy McCutcheon, "ZoneBOND thin wafer support process for wafer bonding applications," Journal of Microelectronics and Electronic Packaging, 2010, pp. 138-142

Vijaya K. Kayastha , Carissa S. Jones , Wu-Sheng Shih , Michael J. Renn, "Next-generation sensing material and device printing technology for sensor applications," International Symposium on Spectral Sensing Research (ISSSR), June 21-24, 2010, pp. [unnumbered]

J. Charbonnier , S. Cheramy , D. Henry , A. Astier , J. Brun , N. Sillon , A. Jouve , S. Fowler , M. Privett , R. Puligadda , J. Burggraf , S. Pargfrieder, "Integration of a temporary carrier in a TSV process flow," 59th Electronic Components and Technology Conference (IEEE ECTC), May 26-29, 2009, pp. 865-871

Rama Puligadda , Qin Lin , William H. Heath , Takeo Suga , Stephen M. June , Timothy E. Long, "Photoactive poly(siloxane imides) as high performance structural adhesives with tailorable interfacial strength," Polymer Preprints, 2009, pp. 841-842

Rama Puligadda , Qin Lin , William H. Heath , Takeo Suga , Stephen M. June , Timothy E. Long, "2-Nitro-p-xylene glycol as a functional monomer for photoreleasable adhesion," Polymer Preprints, 2009, pp. 424-425

A. Jouve , W. Hong , D. Blumenshine , J. Dachsteiner , R. Puligadda , D. Bai , J. Diaz , D. Henry, "Material improvement for ultrathin-wafer handling in TSV creation and PECVD process," IEEE Conference on 3D System Integration, September 28-30, 2009, pp. unnumbered

Carissa S. Jones , Wu-Sheng Shih , Daniel C. Janzen , Xuliang Han , Xuejen Lu , Haitao Xia , Puminun Vasinajinakaw , Haiyan Zhang , Jarrod Vaillancourt , Mike Stroder , Maggie Yihong Chen , Harish Subbaraman , Ray T. Chen , Urs Berger , Mike Renn, "All ink-jet-printed carbon nanotube thin-film transistor on a polyimide substrate with an ultrahigh operating frequency of over 5 GHz," Applied Physics Letters, 2008, pp. 243301-1 - 243301-3

Ramil-Marcelo L. Mercado , Hao Xu , Joyce A. Lowes , Jim D. Meador , Douglas J. Guerrero, "Acid-degradable hyperbranched polymer and its application in bottom anti-reflective coatings," Proceedings of SPIE, 2008, pp. 71402W-1 - 71402W-11

A. Jouve , S. Fowler , M. Privett , R. Puligadda , D. Henry , A. Astier , J. Brun , M. Zussy , N. Sillon , J. Burggraf , S. Pargfrieder, "Facilitating ultrathin wafer handling for TSV processing," 10th IEEE Electronics Packaging Technology Conference (EPTC), 2008, pp. 45-50

Douglas J. Guerrero , Carol Beaman , Rikimaru Sakamoto , Takafumi Endo , Bang-Ching Ho, "Organic underlayers for EUV lithography," Journal of Photopolymer Science and Technology, 2008, pp. 451-455

Gu Xu , Frank D. Blum, "Surfactant-enhanced free radical polymerization of styrene in emulsion gels," Polymer, 2008, pp. 3233-3238

Xuliang Han , Xuejun Lu , Jarrod Vaillancourt , Daniel C. Janzen , Wu-Sheng Shih, "High-speed transparent flexible electronics," Proceedings of SPIE, 2008, pp. 69403A-1 - 69403A-6

Jeremy McCutcheon , Louis McCarthy , JoElle Dachsteiner, "NIR imaging of bond integrity for wafer bonding applications," International Wafer-Level Packaging Conference (IWLPC) Proceedings, October 13-16, 2008, pp. 113-116

Mark Privett , Franz Murauer , Jürgen Burggraf , Stefan Pargfrieder , Chad Brubaker, "TSV thinned wafer debonding process optimization," International Wafer-Level Packaging Conference (IWLPC) Proceedings, October 13-16, 2008, pp. 144-148

Shelly Fowler , Chad Brubaker , John Romain, "Non-destructive method for evaluation of thin wafer edge protection," International Wafer-Level Packaging Conference (IWLPC) Proceedings, October 13-16, 2008, pp. unnumbered

J. Dalvi-Malhotra , X.F. Zhong , C. Planje , K. Yess, "Application of advanced photosensitive etch protection coating," IMAPS Device Packaging Conference, March 17-20, 2008, pp. unnumbered

Ramachandran K. Trichur , Xie Shao, "A photosensitive, spin-applied masking material for through-silicon via formation for wafer-level packaging," Proceedings of SMTA International Conference and Exhibition, August 17-21, 2008, pp. unnumbered

Amadine Jouve , JoElle Dachsteiner , Wenbin Hong , Dongshun Bai , Rama Puligadda , Chad Brubaker , Tian Tang, "Temporary wafer bonding materials with adjustable debonding properties for use in high-temperature processing," IMAPS 2008: Proceedings of the International Microelectronics and Packaging Society 41st International Symposium on Microelectronics, 2008, pp. 222-227

Douglas J. Guerrero, "Anti-reflective coatings: From ground breaking concept to mature industry," [Newsletter of] The Technical Association of Photopolymers, Japan, 2008, pp. 1-3

Wu-Sheng Shih , Jiro Yota , Ketan Itchhaporia, "CON-TACT planarization process of spin-on dielectrics for device fabrication," Journal of the Electrochemical Society, 2008, pp. G65-G71

Rama Puligadda , Doyle Edwards, "High-performance adhesives facilitate ultrathin wafer handling," Future Fab International, 2008, pp. 107-110

Joyce Lowes , Ramil Mercado , Jim Meador , Chris Cox , Douglas Guerrero, "Novel developer-soluble anti-reflective coatings for 248-nm lithography," ISTC2008, Proceedings of the 7th International Conference on Semiconductor Technology, 2008, pp. 255-259

J. Dalvi-Malhotra , X.F. Zhong , C. Planje, "Photosensitive etch protection coating for silicon wet-etch applications," Proceedings of SPIE, 2008, pp. 68840J-1 - 68840J-8

Douglas J. Guerrero , Wen-Li Wu , Eric K. Lin , Sharadha Sambasivan , Daniel Fischer , Joseph L. Lenhart , Yubao Wang , Rama Puligadda, "Understanding deviations in lithographic patterns near interfaces: Characterization of bottom anti-reflective coatings (BARC) and the BARC-resist interface," Applied Surface Science, 2007, pp. 4166-4175

Douglas J. Guerrero , Joyce Lowes , Ramil Mercado, "Organic monolayer determination on semiconductor substrates," Journal of Photopolymer Science and Technology, 2007, pp. 339-343

Ketan Itchhaporia , Hao Ly , Jiro Yota , Wu-Sheng Shih , Alex Smith, "Planarization process for transparent polyimide coatings to reduce topography and overburden variation," Technical Digest, May 14-17, 2007, pp. 195-198

Ketan Itchhaporia , Jiro Yota , Wu-Sheng Shih, "CON-TACT® planarization process of spin-on dielectrics for device fabrication," ECS Transactions, 2007, pp. 501-522

M. Wimplinger , C. Brubaker , T. Matthias , W. Hong , R. Puligadda , A. Smith , S. Pargfrieder, "High temperature–resistant spin-on adhesive for temporary wafer mounting using an automated high-throughput tooling solution," Technical Digest, May 14-17, 2007, pp. 29-32

Ramachandran K. Trichur , Xie Shao, "A photosensitive, spin-applied masking material for through-silicon via formation for wafer-level packaging," International Wafer-Level Packaging Conference (IWLPC) Proceedings, September 17-19, 2007,

Xuliang Han , Daniel C. Janzen , Jarrod Vaillancourt , Xuejun Lu, "Printable high-speed thin-film transistor on flexible substrate using carbon nanotube solution," Micro & Nano Letters, 2007, pp. 96-98

Wenbin Hong , Rama Puligadda , Alex Smith , Dongshun Bai , Stefan Pargfrieder , Chad Brubaker , Sarah Pfeiffer, "High-temperature adhesives for temporary wafer bonding using a sliding approach," IMAPS 2007: Proceedings of the International Microelectronics and Packaging Society 40th International Symposium on Microelectronics, November 11-15, 2007, pp. 1035-1040

Menxing Ouyang , Mandy L.Y. Sin , Gary C.T. Chow , Wen J. Li , Xuliang Han , Daniel C. Janzen, "DEP-Based Fabrication and Characterization of Electronic-Grade CNTs for Nano-Sensing Applications," Proceedings of the 7th IEEE International Conference on Nanotechnology, August 2-5, 2007,

Xuliang Han , Daniel C. Janzen, "Characterization of carbon nanotube thin films formed using electronic-grade carbon nanotube aqueous solutions," Proceedings of SPIE, 2007, pp. 683811-1 - 683811-5

Yanli Qu , Mengxing Ouyang , Wen J. Li , Xuliang Han, "CNTs as ultra-low-powered aqueous flow sensors in PDMS microfluidic systems," Proceedings of the 1st IEEE Conference on Nano/Molecular Medicine and Engineering (IEEE-NANOMED), August 6-9, 2007,

Daniel M. Sullivan , Runhui Huang , Shannon Brown , Anwei Qin, "New developer-soluble gap-fill material," ISTC2007, Proceedings of the 6th International Conference on Semiconductor Technology, 2007, pp. 61-70

Charles J. Neef , Deborah Thomas, "A new wet-developable BARC for 248-nm applications," ISTC2007, Proceedings of the 6th International Conference on Semiconductor Technology, 2007, pp. 709-714

Stefan Pargfrieder , Paul Kettner , Markus Wimplinger , Rama Puligadda, "Ultrathin-wafer processing utilizing temporary bonding and debonding technology," ISTC2007, Proceedings of the 6th International Conference on Semiconductor Technology, 2007, pp. 878-888

J.J. Senkevich , B.W. Woods , J.J. McMahon , P.-I. Wang, "Thermomechanical properties of Parylene X, a room-temperature chemical vapor depositable crosslinkable polymer," Chemical Vapor Deposition, 2007, pp. 55-59

Ramachandran K. Trichur , Gary J. Brand, "A method for edge protection of wafers during wet etching by application of TALON™ wrap process," Commercialization of Micro and Nano Systems Conference (COMS) 2006, August 27-31, 2006, pp. unnumbered

J.J. Senkevich , B.W. Woods , B.P. Carrow , R.D. Geil , B.R. Rogers, "Amorphous highly conjugated chemical-vapor-deposited polymer thin films," Chemical Vapor Deposition, 2006, pp. 285-289

Ramil Mercado , Douglas J. Guerrero , Jim Meador , Carlton Washburn, "Photochemical studies on bottom anti-reflective coatings," Journal of Photopolymer Science and Technology, 2006, pp. 343-347

Xuliang Han, "Characterization of carbonaceous impurity level in as-produced single-walled carbon nanotubes by using solution-phase spectrophotometry," IEEE-Nano 2006, July 17-20, 2006, pp. 636-639

Ryan Buschjost , Joe Graber , Mary Ann Hockey , Ed Brandenburg, "Enhancing the performance of conformal i-line bottom anti-reflective coating products," ISTC2006, Proceedings of the 5th International Conference on Semiconductor Technology, 2006, pp. 644-654

Xiang-Long Xing , Ji-Wei Jiao , Mark Daffron , Yue-Lin Wang , Hyung Choi, "Contact planarization of sacrificial photoresist for MEMS application," Journal of Functional Materials and Devices, April 2006, pp. 135-138, 154

Jyoti Dalvi-Malhotra, "Environmentally friendly i-line anti-reflective coating with reduced formaldehyde content," Polymeric Materials: Science and Engineering, 2006, pp. 1113-1114

B. Hosse , J. Moore , A. Smith, "A chemical and thermal resistant wafer bonding adhesive simplifying wafer backside processing," CS MANTECH: 2006 International Conference on Compound Semiconductor Manufacturing Technology Digest of Papers, April 24-27, 2006, pp. 269-271

Gu Xu , Rakesh R. Nambiar , Frank D. Blum, "Room-temperature decomposition of 2,2'-azobis(isobutyronitrile) in emulsion gels with and without silica," Journal of Colloid and Interface Science, 2006, pp. 658-661

Jay J. Senkevich , Brad Carrow , Pei-I Wang, "Thermal and dielectric stability of Parylene X," Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects: Materials Research Society Symposium Proceedings, 2006, pp. 101-106

Jarrod Vaillancourt , Daniel C. Janzen , Xuliang Han , Xuejun Lu, "A flexible thin-film transistor with high field-effect mobility by using carbon nanotubes," Proceedings of the IEEE Nanotechnology Materials and Devices Conference (IEEE-NMDC 2006), October 22-25, 2006, pp. 296-297

Douglas Guerrero , Ramil Mercado , Carlton Washburn , Jim Meador, "Controlling CD and process window limits for implant patterning," Solid State Technology, October 2006, pp. 53-56

D.C. Janzen , X. Han , X. Lu , J. Vaillancourt, "High-speed thin-film transistor on flexible substrate fabricated at room temperature," Electronics Letters, November 9, 2006, pp. 1365-1366

S. Pillalamarri , R. Puligadda , C. Brubaker , M. Wimplinger , S. Pargfrieder, "High-temperature spin-on adhesives for temporary wafer bonding," IMAPS 2006: Proceedings of the International Microelectronics and Packaging Society 39th International Symposium on Microelectronics, October 8-12, 2006, pp. 105-111

J.J. Senkevich , G.-R. Yang , C.J. Mitchell, "Adhesion aspects of poly(p-xylylene) to SiO₂ surfaces using γ-methacryloxypropyltrimethoxysilane as an adhesion promoter," Journal of Adhesion Science and Technology, October 2006, pp. 1637-1647

Xuliang Han, "Evaluation of carbonaceous impurities in as-produced single-walled carbon nanotubes by solution-phase spectrophotometry," Proceedings of the 1st IEEE International Conference on Nano-/Micro-Engineered and Molecular Systems (IEEE-NEMS 2006), January 18-21, 2006, pp. 1491-1493

M. Daffron , W.-S. Shih , K. Marler, "CON-TACT® brand planarization and ENSEMBLE* CP dielectric coating: Smoothing out the bumps on the road to 90nm technology and beyond," Proceedings of the 4th International Conference on Semiconductor Technology (ISTC 2005), 2005, pp. 620-629

B.W. Woods , R.E. Murray , B.P. Carrow , J.J. Senkevich, "Poly(ethynyl-p-xylylene), an advanced molecular caulk CVD polymer," Materials Research Society Symposium Proceedings, 2005, pp. 189-194

James B. Claypool , Marc Weimer , Vandana Krishnamurthy , Wendy Gehoel , Koen van Ingen Schenau, "New advanced BARC materials for ultra-high NA applications," Proceedings of SPIE: Advances in Resist Technology and Processing XXII, 2005, pp. 679-689

Andy Waite-Wright, "Industry roadmaps must enable rebirth of innovation," WaferNEWS, July 2005, pp. 17-18

Curt Planje , Doug Holmes , Robert Morford , Gary Brand , Zhimin Zhu , Aaron Jacobs, "High refractive index polymer coatings," Proceedings of the 14th International Conference on Polymer Optical Fiber, 2005, pp. 65-69

Darron Dippel , Carlton Washburn , Kevin Edwards, "CD uniformity and bias improvement in the via-first dual damascene process using a developer-soluble gap-fill material," INTERFACE 2005: Proceedings of the 42nd Microlithography Symposium, October 23-25, 2005, pp. 27-1 - 27-7

Carlton Washburn, "Reducing 300 mm wafer coating defects without compromising uniformity," Semiconductor Manufacturing, May 2005, pp. 34-35

JoElle Dachsteiner , Rebecca Rich , Wu-Sheng Shih , Mark Daffron , Julie Snook, "The use of CON-TACT(R) brand planarization to improve planarity for shallow trench isolation (STI) applications," SEMICON West 2004, SEMI Technology Symposium: Innovations in Semiconductor Manufacturing, July 14, 2004, pp. 85-92

Yoko Kishi , Katsu Kawabata , Haiying Shi , Robert Thomas, "Reduction of Carbon-Based Interferences in Organic Compound Analysis by Dynamic Reaction Cell ICP MS," Spectroscopy, September 2004, pp. 14-23

Mariya Nagatkina , Marc Weimer , Runhui Huang, "A 193-nm Bottom Anti-Reflective Coating with Broad Photoresist Compatibility," INTERFACE 2004: Proceedings of the ARCH Chemicals Microlithography Symposium, September 26-28, 2004, pp. unnumbered

Paul Williams , Kevin Edwards , Nick Brakensiek , Deng Jian Ping, "Advanced process considerations for BARC and gap fill technology in via-first Dual Damascene integration for sub 0.13-u technology," SEMICON China 2004 SEMI Technology Symposium, March 17-19, 2004,

Wu-Sheng Shih , Charles J. Neef , Mark G. Daffron, "A Planarization Process for Multi-Layer Lithography Applications," Proceedings of SPIE: Advances in Resist Technology and Processing XXI, 2004, pp. 664-672

Isabelle Guilmeau , Alice Guerrero , Vincent Blain , Stephanie Kremer , Vincent Vachellerie , Damien Lenoble , Patricia Nogueira , Sebastien Mougel , Jean-Damien Chapon, "Evaluation of wet-developable KrF organic BARC to improve CD uniformity for implant application," Proceedings of SPIE: Advances in Resist Technology and Processing XXI, 2004, pp. 461-470

Mark Daffron , Wu-Sheng Shih , Rebecca Rich, "The Use of Modified Processes to Reduce Feature Density Effects Observed During Contact Planarization Processes," Proceedings of the Ninth International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC), 2004, pp. 377-384

Kimberly Ruben , Tony Flaim , Chenghong Li, "Polymeric Protective Coatings for MEMS Wet-Etch Processes," Proceedings of SPIE: Micromachining and Microfabrication Process Technology IX, 2004, pp. 212-220

Jeremy W. McCutcheon, "Research on a novel planarization method as an alternative or complement to CMP," Proceedings of the Eighth International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC), 2003, pp. 283-290

Tony Flaim , Bill DiMenna , Douglas J. Guerrero , Ramil Mercado , Sam Sun, "Dyed red, green, and blue photoresist for manufacture of high resolution color filter arrays for image sensors," Proceedings of SPIE: Sensors and Camera Systems for Scientific, Industrial, and Digital Photography Applications IV, 2003, pp. 298-306

Erin L. Jablonski , Sharadha Sambasivan , Eric K. Lin , Daniel A. Fischer , Chelladurai Devadoss , Rama Puligadda, "Near edge x-ray absorption fine structure measurements of the interface between bottom antireflective coatings and a model deprotected photoresist," Journal of Vacuum Science and Technology B, November-December 2003, pp. 3153-3156

Jim D. Meador , Doug Holmes , William L. DiMenna , Mariya Nagatkina , Michael Rich , Tony Flaim , Randy Bennett , Ichiro Kobayashi, "193-nm Multilayer Imaging Systems," Proceedings of SPIE: Advances in Resist Technology and Processing XX, 2003, pp. 948-959

Kelly A. Nowak, "Void Elimination Research in Bottom Anti-Reflective Coatings for Dual Damascene Photolithography," Proceedings of SPIE: Advances in Resist Technology and Processing XX, 2003, pp. 891-901

Vandana Krishnamurthy , Charles J. Neef , Stephen R. Turner, "Novel Spin Bowl Compatible, Wet Developable Bottom Anti-Reflective Coating for i-Line Applications," Proceedings of SPIE: Advances in Resist Technology and Processing XX, 2003, pp. 883-890

Chris Cox , Darron Dippel , Craig Ghelli , Pat Valerio , Bill Simmons , Alice Guerrero, "Developer Soluble Organic BARCs for KrF Lithography," Proceedings of SPIE: Advances in Resist Technology and Processing XX, 2003, pp. 878-882

Charles Neef , Michelle Fowler , Michelle Windsor , Cheryl Nesbit, "New Materials for 193-nm BARC Application," Proceedings of SPIE: Advances in Resist Technology and Processing XX, 2003, pp. 872-877

Marc Weimer , Vandana Krishnamurthy , Shelly Fowler , Cheryl Nesbit , James Claypool, "New Material for 193-nm Bottom Anti-Reflective Coatings," Proceedings of SPIE: Advances in Resist Technology and Processing XX, 2003, pp. 866-871

Nickolas L. Brakensiek , Brian Kidd , Michael Mesawich , Don Stevens , Jr. , Barry Gotlinsky, "Spin-on Bottom Antireflective Coating Defect Reduction by Proper Filter Selection and Process Optimization," Proceedings of SPIE: Advances in Resist Technology and Processing XX, 2003, pp. 858-861

Douglas J. Guerrero , Tonya Trudgeon, "A New Generation of Bottom Anti-Reflective Coatings (BARCs): Photodefinable BARCs," Proceedings of SPIE: Advances in Resist Technology and Processing XX, 2003, pp. 129-135

Stephen Gibbons , Terry Toddy , Heping Wang , Trisha May, "Development of a Polymer Etch Rate Monitor: Design, Characterization, and Application," Proceedings of SPIE: Metrology, Inspection, and Process Control for Microlithography XVII, 2003, pp. 1012-1018

Mary Spencer , Kim Ruben , Chenghong Li , Paul Williams , Tony Flaim, "Polymer protective coating for wet deep silicon etching processes," Proceedings of SPIE: Micromachining and Microfabrication Process Technology VIII, 2003, pp. 79-86

Carlton A. Washburn , Nickolas L. Brakensiek , Earnest Murphy, "Novel BARC Etchback Process for Via-First Dual Damascene Processes," INTERFACE 2003: Proceedings of the ARCH Chemicals Microlithography Symposium, September 22-23, 2003, pp. unnumbered

Liu He , Rama Puligadda , Joyce Lowes , Michael Rich, "Bottom Anti-Reflective Coatings (BARCs) for 157-nm Lithography," Proceedings of SPIE: Optical Microlithography XVI, 2003, pp. 1386-1395

Chelladurai Devadoss , Yubao Wang , Rama Puligadda , Joseph L. Lenhart , Erin L. Jablonski , Daniel A. Fischer , Sharadha Sambasivan , Eric K. Lin , Wen-Li Wu, "Investigation of BARC-Resist Interfacial Interactions," Proceedings of SPIE: Optical Microlithography XVI, 2003, pp. 912-922

Jacquelynn Backus , Trisha May , Kelly A. Nowak , Brian Davis , John Thompson , Denise Howard, "Void elimination research in bottom anti-reflective coatings for dual damascene photolithography," INTERFACE 2002: Proceedings of the Arch Chemicals/FUJIFILM Arch Microlithography Symposium, September 22-24, 2002, pp. unnumbered

Ram W. Sabnis , Mary J. Spencer , Douglas J. Guerrero, "Novel organic, polymeric materials for electronics applications," Materials Research Society Symposium Proceedings, Spring 2002, pp. K9.16.1-K9.16.6

James E. Lamb III, "Research on a Novel Planarization Method as an Alternative to CMP," SEMI Technical Symposium (STS): Innovations in Semiconductor Manufacturing (SEMICON West 2002), 2002, pp. 171-173

Douglas J. Guerrero , Tony D. Flaim, "Photosensitive Titania Polymers," Journal of Photopolymer Science and Technology, 2002, pp. 447-451

Charles J. Neef , Vandana Krishnamurthy , Stephen R. Turner, "Novel spin bowl compatible, wet developable bottom anti-reflective coating for i-line applications," Polymeric Materials: Science and Engineering, 2002, pp. 199-200

Nickolas L. Brakensiek, "Bottom Anti-Reflective Coating Processing Techniques for Via-First Dual Damascene Processes," Proceedings of SPIE: Optical Microlithography XV, 2002, pp. 927-936

Mandar Bhave , Jill Akers , James Claypool , Jim Meador , Anne Lindgren, "Thin Organic Bottom Antireflective Coatings for 193nm Lithography," Proceedings of SPIE: Advances in Resist Technology and Processing XIX, 2002, pp. 1074-1084

James Claypool , Rama Puligadda , Jill Akers , Rikimaru Sakamoto , Ken-ichi Mizusawa, "Design Considerations for Bottom Antireflective Coating for 157nm Lithography," Proceedings of SPIE: Advances in Resist Technology and Processing XIX, 2002, pp. 1065-1073

Nickolas L. Brakensiek , Chris Cox , Rama Puligadda, "Processing Techniques for Novel BARC Chemistries," Proceedings of SPIE: Advances in Resist Technology and Processing XIX, 2002, pp. 1043-1051

Gary Brand , Lorie Rieken , Curtis Planje , Jonathan Mayo , Gu Xu, "High Resolution Dyed Color Filter Material for Use in Digital Photography Applications - Cyan, Magenta, and Yellow Color Photoresists," Proceedings of SPIE: Sensors and Camera Systems for Scientific, Industrial, and Digital Photography Applications III, 2002, pp. 377-383

R. Fang , H. Gu , M.J. O'Keefe , T.J. O'Keefe , W.-S. Shih , K.D. Leedy , R. Cortez, "Spontaneous, non-aqueous electrochemical deposition of copper and palladium on Al and Al(Cu) thin films," Journal of Electronic Materials, 2001, pp. 349-354

Min-Shyan Sheu , Mary J. Spencer , Douglas J. Guerrero , William L. DiMenna , Mario Cazeca , Ram W. Sabnis, "Organic polymeric coatings deposited by plasma enhanced chemical vapor deposition," Journal of Vacuum Science and Technology, November-December 2001, pp. 2184-2189

Shreeram Deshpande , Nick Brakensiek , Paul Williams , Kelly Nowak , Shelly Fowler, "Sub 0.35¨µm i-Line Lithography with New Advanced Bottom Anti-Reflective Coatings Optimized for High Topography and Dual Damascene Applications," Proceedings of SPIE: Lithography for Semiconductor Manufacturing II, 2001, pp. 354-367

Tianyue Yu , Philip Ching , Christopher Ober , Shreeram Deshpande , Rama Puligadda, "Development of a Bond Contribution Model for Structure: Property Correlations in Dry Etch Studies," Proceedings of SPIE: Advances in Resist Technology and Processing XVIII, 2001, pp. 945-951

Shreeram Deshpande , Kelly Nowak , Shelly Fowler , Paul Williams , Manuel Arjona, "Novel Conformal Organic Anti-Reflective Coatings for Advanced i-Line Lithography," Proceedings of SPIE: Advances in Resist Technology and Processing XVIII, 2001, pp. 855-863

Jim D. Meador , Xie Shao , Mandar Bhave , Chris Cox , John Thompson , Deborah Thomas , Stephen Gibbons , Ashley Farnsworth , Michael Rich, "Improved Crosslinkable Polymeric Binders for 193-nm Bottom Antireflective Coatings (BARCs)," Proceedings of SPIE: Advances in Resist Technology and Processing XVIII, 2001, pp. 846-854

Yubao Wang , Xiaoming Wu , Gu Xu , Jim Lamb III , John Sullivan , James Claypool , Jackie Backus , Sean Trautman , Xie Shao , Satoshi Takei , Yasuhisa Sone , Kenichi Mizusawa , Hiroyoshi Fukuro, "Development of Full-Fill Bottom Anti-Reflective Coatings for Dual Damascene Process," Proceedings of SPIE: Advances in Resist Technology and Processing XVIII, 2001, pp. 838-845

Rama Puligadda , Runhui Huang , Chris Cox , James E. Lamb III , Manuel Arjona , James Claypool, "New Fast Etching Bottom Antireflective Coatings for 248nm Lithography," Proceedings of SPIE: Advances in Resist Technology and Processing XVIII, 2001, pp. 829-837

Runhui Huang , Ryan Giedd, "Electrical Characterization of an Ion Beam Mixed Metal/Polymer System," Proceedings of SPIE: Metrology, Inspection, and Process Control for Microlithography XV, 2001, pp. 583-588

Xie Shao , Jim Meador , Shree Deshpande , Rama Puligadda , Kenichi Mizusawa , Shinya Arase, "Recent Progress in Organic Bottom Anti-reflective Coatings," Journal of Photopolymer Science and Technology, 2001, pp. 481-488

Tom Evers , Jo Mayo , Tim Limmer , Gu Xu , John Berges, "Novel Photo Sensitive Pigmented Color Filter Materials," SEMICON China 2001 SEMI Technical Symposium, March 28-29, 2001, pp. FF-1 - FF-5

T.J. O'Keefe , H. Gu , R. Fang , M.J. O'Keefe , W.-S. Shih , K.D. Leedy , R. Cortez, "An alternative metallic seeding technique for subsequent electrochemical deposition of copper onto barrier metals," Advanced Metallization Conference 2000 (AMC 2000), October 2-5, 2000, pp. 137-143

W.-S. Shih , J.A.M. Snook , D.J. Guerrero , M.J. O'Keefe, "Selective deposition of metals for integrated circuits packaging applications," IMAPS International Advanced Technology Workshop on Flip Chip Technology, March 3-5, 2000, pp. unnumbered

Benedicte Mortini , Severine Gally , Patrick J. Paniez , Samir Derrough , Xie Shao, "Investigation of 193 nm resist/organic BARC compatibility and optimization of BARC process conditions," INTERFACE 2000: Proceedings of the ARCH Microlithography Symposium, November 5-7, 2000, pp. 163-173

Paul Williams , Alice Martin , Marlene Stroble , Bill Roberts , Frank Goodwin , Lars Vslkel , Axel Fiecke , Sean Trautman , Jim Lamb III, "Optimization of the planarizing performance of a DUV organic bottom anti-reflective coating for via first dual damascene process: Cooperation to achieve material and process characterization," Proceedings of SPIE: Microlithographic Techniques in Integrated Circuit Fabrication II, 2000, pp. 160-168

Jim D. Meador , Xie Shao , Vandana Krishnamurthy , Manuel Arjona , Mandar Bhave , Gu Xu , James Claypool , Anne Lindgren, "Second-Generation 193-nm Bottom Antireflective Coatings (BARCs)," Proceedings of SPIE: Advances in Resist Technology and Processing XVII, 2000, pp. 1009-1018

George E. Bailey , Nicholas K. Eib , Earnest C. Murphy, "Progressions in deep ultraviolet bottom antireflective coatings," Proceedings of SPIE: Advances in Resist Technology and Processing XVII, 2000, pp. 935-948

Xiaoming Wu , Joe Johnson , Nick Brakensiek , James Lamb III , Xie Shao , Shreeram Deshpande , Gu Xu , Bill Simmons, "Advancements in Organic Anti-Reflective Coatings for Dual Damascene Processes," Proceedings of SPIE: Metrology, Inspection, and Process Control for Microlithography XIV, 2000, pp. 797-805

H. Gu , T.J. O'Keefe , M.J. O'Keefe , K.D. Leedy , R. Cortez , R.E. Strawser , W.-S. Shih, "Spontaneous electrochemical deposition of metals from organic solutions," Electrochemical Society Proceedings: Fundamentals of Electrochemical Deposition and Dissolution, 1999, pp. 242-251

Ram W. Sabnis, "Color filter technology for liquid crystal displays," Displays, November 1999, pp. 119-129

N.D. Sonawane , D.W. Rangnekar , R.W. Sabnis, "2-Aminothiophenes by the Gewald Reaction," Journal of Heterocyclic Chemistry, March-April 1999, pp. 333-345

Sharon Scott , Paul Williams , James Lamb III , Xie Shao , Joe Johnson , Bill Simmons , Shree Desphande, "Organic Anti-Reflective Coatings for Dual Damascene Applications," INTERFACE '99: Proceedings of the ARCH Microlithography Seminar, 1999, pp. 183-195

Hubert Enichlmair , Oliver Stelmaszyk , Paul Williams, "Optimization of a wet-patterning bottom antireflective i-line coating for both poly gate and metal lithography processes," Proceedings of SPIE: Microelectronic Device Technology III, 1999, pp. 265-273

Jim D. Meador , Douglas J. Guerrero , Gu Xu , Xie Shao , Norm Dobson , James Claypool , Kelly Nowak, "Recent Progress in 193 nm Antireflective Coatings," Proceedings of SPIE: Advances in Resist Technology and Processing XVI, 1999, pp. 800-809

Bill Simmons , James Claypool , Jim E. Lamb III , Xie Shao , Earnie Murphy, "Broadband planarizing anti-reflective coating for i-line, DUV and 193nm microlithographic applications," Proceedings of SPIE: Metrology, Inspection, and Process Control for Microlithography XIII, 1999, pp. 884-894

Y.Q. Wang , J. Kaufmann , M.G. Moss , R.E. Giedd, "Electrical applications of ion-implanted polymer films," Electrical and Optical Polymer Systems: Fundamentals, Methods, and Applications, 1998, pp. 1011-1030

R.W. Sabnis , J.W. Mayo , M.D. Stroder , K. Aoba , K. Ema , Y. Sone , T. Nihira , A. Yanagimoto, "A novel, photosensitive ultrathin black matrix system," Asia Display '98, 1998, pp. 1025-1028

R. Fang , H. Gu , M.J. O'Keefe , T.J. O'Keefe , W.-S. Shih , K.D. Leedy , R. Cortez, "Maskless direct deposition of copper onto aluminum bond pads for flip chip applications," Materials Research Society Symposium Proceedings, 1998, pp. 85-90

R.W. Sabnis , M.D. Stroder , R.E. Nichols , E.G. Hays , A. Yanagimoto , Y. Sone , Y. Watanabe , K. Ema, "High-Optical-Density Ultra-Thin Black-Matrix System," Society for Information Display '98 Symposium Digest, 1998, pp. 548-551

Heping Wang , Patricia M. Callahan, "Adsorption studies of azo dyes as resonance Raman spectroscopic probes at solid-liquid interfaces," Journal of Chromatography A, December 1998, pp. 121-134

Douglas J. Guerrero , Jim D. Meador , Gu Xu , Hitoshi Suzuki , Yasuhisa Sone , Vandana Krishnamurthy , James Claypool , James E. Lamb III, "Deep Ultraviolet Antireflective Coating with Improved Conformality, Optical Density, and Etch Rate," Proceedings of SPIE: Advances in Resist Technology and Processing XV, 1998, pp. 228-235

Colin Hester , Jim Lamb , Xie Shao , Paul Williams , Tony Flaim, "Fast Etch Anti-Reflective Coating for Sub-0.35μm i-Line Microlithography Applications," Proceedings of SPIE: Metrology, Inspection, and Process Control for Microlithography XII, 1998, pp. 518-525

Maaike Op de Beeck , Geert Vandenberghe , Patrick Jaenen , Feng-Hong Zhang , Christie Delvaux , Ilse van Puyenbroeck , Kurt Ronse , James E. Lamb III , Johan B.C. van der Hilst, "Optimisation of bottom-ARC processes with respect to CD control," Future Fab International, 1998, pp. 205-210

Maaike Op de Beeck , Geert Vandenberghe , Patrick Jaenen , Feng-Hong Zhang , Christie Delvaux , Paul Richardson , Ilse van Puyenbroeck , Kurt Ronse , James E. Lamb III , Johan B.C. van der Hilst , Johannes van Wingerden, "Bottom-ARC optimization methodology for 0.25 um lithography and beyond," Proceedings of SPIE: Optical Microlithography XI, 1998, pp. 322-336

Gu Xu , Douglas J. Guerrero , Norman J. Dobson, "New Antireflective Coatings for 193 nm Lithography," Proceedings of SPIE: Advances in Resist Technology and Processing XV, 1998, pp. 524-531

Y.Q. Wang , R.E. Giedd , M.G. Moss , J. Kaufmann, "Electronic properties of ion-implanted polymer films," Nuclear Instruments and Methods in Physics Research B, 1997, pp. 710-715

R.E. Giedd , M.G. Moss , J. Kaufmann , Y.Q. Wang, "Ion beam modification of polymers," Application of Accelerators in Research and Industry, AIP Conference Proceedings, 1997, pp. 993-996

J. Kaufmann , M.G. Moss , R.E. Giedd , Y.Q. Wang, "Inhomogeneous Characterstic of Ion-Implanted Polymers within the Implanted Layer," Application of Accelerators in Research and Industry, 1997, pp. 985-988

Tony D. Flaim , Xie Shao, "Design and Performance of Polymeric Anti-Reflective Coatings for Advanced i-Line Photoresist Processes," Proceedings, 11th International Conference, Photopolymers: Principles, Processes, and Materials, October 6-8, 1997, pp. 323-338

James Kaufmann , Mary G. Moss , Y.Q. Wang , Ryan E. Giedd, "Versatile applications of ion implanted polymers," Materials Research Society Symposium Proceedings, 1996, pp. 305-310

Jonathan W. Mayo , Michael J. Pfeiffer , Michael D. Stroder , Alain Dunand , Stephane Vago , Benedicte Galea , Jim Sedon , Mark Newsham , Brian Martin , Don Perettie , Ben DeKoven, "Colour Filters for Flat Panel Displays by High Definition Ink Jet Printing," Society for Information Display Euro '96 Proceedings, 1996, pp. 537-540

L. Jeff Myron , Gery Armaly , Heping Wang, "Mobile Phase Modification in Polyamic Acid Molecular Weight Measurement by Gel Permeation Chromatography," Proceedings of the International GPC Symposium '96, September 8-11, 1996, pp. 484-498

Y. Watanabe , Y. Sone , A. Yanagimoto , E.G. Hays , M.D. Stroder , J.W. Mayo , R.W. Sabnis , K. Ema, "A Novel Black Matrix System," Proceedings of Sixteenth International Display Research Conference (IDRC), SID's 16th International Display Research Conference, Euro Display '96, 1996, pp. 240-243

James Kaufmann , Mary G. Moss , Yongqiang Wang , Ryan E. Giedd, "Conductive Polymer Films for Microbolometer Applications," Proceedings of SPIE: Infrared Technology and Applications XXII, 1996, pp. 334-344

Chang-Ming Dai , Chin-Lung Lin , Shi-Chang Tai , James E. Lamb III , M. Iida, "Post Exposure Baking Temperature Effect on Resist Profile with Bottom Anti-reflective Coating," Proceedings of SPIE: Optical Microlithography IX, 1996, pp. 598-607

Vanada Krishnamurthy , Tony Flaim , Linda Insalaco , John Sturtevant , Jim Meador , John Peterson , Andy Eckert, "Removable Organic Antireflection Coating," Proceedings of SPIE: Advances in Resist Technology and Processing XIII, 1996, pp. 738-746

Edward K. Pavelchek , Jim D. Meador , Douglas J. Guerrero , James E. Lamb III , Ajit Kache , Manuel doCanto , Timothy G. Adams , David Stark , Danny Miller, "A Highly Absorbing ARC for DUV Lithography," Proceedings of SPIE: Advances in Resist Technology and Processing XIII, 1996, pp. 692-699

James Kaufmann , Mary G. Moss , Yongqiang Wang , Ryan E. Giedd, "Suspended Conductive Polymer Bridges from Ion Implanted Polymers," Materials Research Society Symposium Proceedings, 1996, pp. 329-334

Jim Lamb, "Anti-reflective coatings," European Semiconductor, February 1995, pp. 13-15

James E. Lamb III, "Organic ARC Anti-Reflective Coating Application within the Microelectronics Industry," Semiconductor Fabtech, 1995, pp. 223-227

L. Insalaco , V. Krishnamurthy , John Sturtevant , J. Mitchener, "UV Pretreatments for Improved Etching of Organic ARC Layer," Proceedings of SPIE: Advances in Resist Technology and Processing XII, 1995, pp. 540-550

Elliott Capsuto , Ardavan Niroomand, "Characterization of an advanced i-line bottom anti-reflecting coating for a 400mm process," INTERFACE '94: Proceedings of the OCG Microelectronic Materials Microlithography Seminar, 1994, pp. 183-195

Y.Q. Wang , D.S. Robey , R.E. Giedd , M.G. Moss, "Piezoresistivity in ion implanted polymer films," Materials Research Society Symposium Proceedings, 1994, pp. 349-354

R.E. Giedd , D. Robey , Y.Q. Wang , M.G. Moss , J. Kaufmann, "The electronic microstructure in the implant layer of ion implanted polymers," Materials Research Society Symposium Proceedings, 1994, pp. 75-80

J. Hunninghake , M. Stroder , J. Mayo , G. Brand , E. Hays, "A Systems Approach to Color Filters for Flat-Panel Displays," SID 94 Digest, 1994, pp. 407-410

James Lamb, "A customer-supplier partnership resolves manufacturing and defect issues," Solid State Technology, 1994, pp. 55

R.A. Mayanovic , Y. Feng , K.W. Groh , Y. Wang , R.E. Giedd , M.G. Moss, "Local Structure Surrounding Implanted As+ Ions in Polysulfone Films," Materials Research Society Symposium Proceedings, 1994, pp. 113-116

Joseph A. Raposo , Vijay P. Singh , John C. McClure , Raymond G. Bell , Jonathan W. Mayo, "Current transport and aging in direct-current powder electroluminescent display devices," Journal of the Society for Information Display, 1993, pp. 397-403

Y.P. Feng , D.S. Robey , Y.Q. Wang , R.E. Giedd , M.G. Moss, "Conductivity and stability in ion-implanted polyaniline," Materials Letters, 1993, pp. 167-170

Mary G. Moss , James Lamb, "Expanding Photolithography Process Latitude with Organic AR Coatings," Solid State Technology, September 1993, pp. 79-83

V.P. Singh , J.A. Raposo , J.C. McClure , R.G. Bell , J.W. Mayo, "A Study of Modified Structures for Reducing Aging Effects in DCPEL Display Devices," SID 93 Digest, 1993, pp. 859-862

Gregg A. Barnes , Tony D. Flaim , Susan K. Jones , Bruce W. Dudley , David A. Koester , Charles R. Peters , Stephen M. Bobbio, "Anti-Reflective Coating for Deep UV Lithography Process Enhancement," Polymer Engineering and Science, Mid-November 1992, pp. 1578-1582

Bruce W. Dudley , Susan K. Jones , Charles R. Peters , David A. Koester , Gregg A. Barnes , Tony D. Flaim , James E. Lamb III, "Enhancement of Deep UV Patterning Integrity and Process Control Using Anti-Reflective Coating," Proceedings of SPIE: Advances in Resist Technology and Processing IX, 1992, pp. 638-646

Michael J. Pfeiffer , Chung-Peng Ho , Tony D. Flaim, "All-trans polyamic esters as precursors to rigid rod polyimides," Advances in Polyimide Science and Technology, Proceedings of the Fourth International Conference on Polyimides, October 30-November 1, 1991, pp. 213-219

Gregg A. Barnes , Susan K. Jones , Bruce W. Dudley , David A. Koester , Charles R. Peters , Stephen M. Bobbio , Tony D. Flaim, "Anti-reflective coating for deep UV lithography process enhancement," Photopolymers: Principles - Processes and Materials, October 28-30, 1991, pp. 259-270

D.E. Robertson , M.M. Craig , M.G. Moss , Ryan E. Giedd, "Temperature sensitive ion-implanted polymer films," Nuclear Instruments and Methods in Physics Research [Netherlands], 1991, pp. 1253-1256

S. Sethi , R. Distasio , D. Ziger , J. Lamb , T. Flaim, "Use of anti-reflective coatings in deep UV lithography," Proceedings of SPIE: Optical/Laser Microlithography IV, 1991, pp. 30-40

B. Martin , A.N. Odell , J. E. Lamb III, "Improved Bake Latitude Organic Anti-Reflective Coatings for High Resolution Metallisation Lithography," Proceedings of SPIE: Advances in Resist Technology and Processing VI, 1989, pp. 543-554

Mary G. Moss , Ruth M. Cuzmar , Terry Brewer, "Positive-working polyimide resists based on diazonaphthoquinone photochemistry," Proceedings of SPIE: Advances in Resist Technology and Processing VI, 1989, pp. 396-405

John J. Gostic, Jr. , Dan W. Hawley , William J. Latham, "High absorptivity organic coatings from transparent precursors," Proceedings of SPIE: Liquid Crystal Chemistry, Physics, and Applications, 1989, pp. 227-231

Mary G. Moss , Barbara L. Horter , Tony D. Flaim, "Synthesis of Polyamic Esters by Reaction of Polyamic Acid Salts With Alkyl Halides," Polyimides: Synthesis, Characterization and Application, Proceedings of Third International Conference on Polyimides, Ellenville, New York, November 2-4, 1988, 1989, pp. 279-291

William J. Latham , Dan W. Hawley, "Color Filters from Dyed Polyimides," Solid State Technology, May 1988, pp. 223-226

Mary G. Moss , Chung-Peng Ho, "Novel High Resolution Imagable Polyimide Siloxane for Electron Beam Lithography," Proceedings of the ACS Division of Polymeric Materials: Science and Engineering, 1988, pp. 1019-1023

James E. Lamb III , Donna D. Hawley , J. Michael Mori, "Spin-On Dry Etch Process for Submicron Lithography," Microelectronic Engineering, December 1987, pp. 85-90

William J. Latham , Terry L. Brewer , Dan W. Hawley , James E. Lamb III , Lynn K. Stichnote, "Polyimide Color Filters for Liquid-Crystal Displays," Proceedings of the SID, 1987, pp. 385-389

William J. Latham , Terry L. Brewer , Dan W. Hawley , James E. Lamb III , Lynn K. Stichnote, "A New Class of Color Filters for Liquid-Crystal Displays," SID 87 Digest, 1987, pp. 379-382

Chung-Peng Ho , Ruth Cuzmar , Mary G. Moss , Russ Pagel , Terry Brewer, "Electron-Beam Lithographic Properties of Polyimides," Proceedings of the ACS Division of Polymeric Materials: Science and Engineering, 1986, pp. 741-745

William J. Latham, "A Black, Patternable Polyimide Coating for Monolithic Optoelectronics Applications," Proceedings of SPIE: Integration and Packaging of Optoelectronic Devices, 1986, pp. 175-179

Mike Schmidt, "Novel Reverse Osmosis Membranes by Plasma Polymerization," Ultrapure Water, March-April 1985, pp. 28-30

Richard D. Coyne , Terry Brewer, "Resist processes on highly reflective surfaces using antireflection coatings," INTERFACE '83: Proceedings of the Kodak Microelectronics Seminar, November 14-15, 1983, pp. 40-51

Terry Brewer , Robert Carlson , John Arnold, "The Reduction of the Standing-Wave Effect in Positive Photoresists," Journal of Applied Photographic Engineering, December 1981, pp. 184-186