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How Temporary Bonding Works Learn how temporary bonding and ultra-thin wafers are being used to create smaller and faster electronic devices. Check out our temporary bonding materials here
May 31, 2017 Video Read MoreBrewer Science Inflect™ Flex Sensor InFlect™ flex sensors utilize our revolutionary carbon-based nanotechnology to deliver a highly sensitive and real-time response to varying angles of deflection.
Read MoreMultilayer technology from Brewer Science has allowed the industry to continue to push the limits of advanced lithography well into the future. Our experts explain why it was needed and…
Read MoreProTEK® Materials Highly oleophobic and hydrophobic transparent scratch-resistant coating.
Read MoreWhy do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and…
Read MoreWhat is "Fan-out Wafer-Level Packaging"? Fan-out wafer-level packaging (FOWLP) has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and…
Read Morehttps://www.youtube.com/watch?v=bglxxfQyaFk Brewer Science InFlect™ Sensors In an industry where milliseconds count, contact a Brewer Science expert to start monitoring and understanding your process better.
Read MoreHigh-Speed Temperature Sensing in Roll-to-Roll Processing Brewer Science printed thermistors are among the fastest on the market, are highly accurate, and can operate at extremely low power, due to a…
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