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Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023

Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023 Innovative bonding materials presented at leading Asia technology conferences Tapei, Taiwan – August 28, 2023…

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Event
Brewer Science Expands Vichy Manufacturing Center to Support Semiconductor Growth

Vichy, Missouri - August 15, 2023 - Brewer Science, a global leader in developing and manufacturing next-generation materials and products for the semiconductor industry, is thrilled to announce the expansion…

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Event
Brewer Science Presents Printed and Flexible CO2 Sensors at Carbon 2023 Conference

Brewer Science Presents Printed and Flexible CO2 Sensors at Carbon 2023 Conference     Cost-efficient and robust screen-printed sensors are the future of CO2 sensing   Cancun, Mexico– July 13, 2023 –Brewer…

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June 22, 2023 Press Release
Brewer Science Earns Intel’s 2023 EPIC Distinguished Supplier Award

Brewer Science is one of only 22 Distinguished Award recipients across Intel’s global supply chain   Rolla, MO, June 22, 2023 – Brewer Science is proud to announce that it…

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June 15, 2023 Press Release
Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes

Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes OptiStack® SOC450 material provides zero shrinkage up to 550°C when baking in N2 June 15, 2023 – Rolla,…

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Imec and Brewer Science present process solutions for CVD oxide deposition processes on ultrathin wafers at Electronic Components and Technology Conference (ECTC)

Imec and Brewer Science present process solutions for CVD oxide deposition processes on ultrathin wafers at Electronic Components and Technology Conference (ECTC) Process challenges during CVD oxide deposition on the…

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May 09, 2023 Press Release
Brewer Science and PulseForge Bring Photonic Debonding to Semiconductor Advanced Packaging at Scale

Co-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in Orlando, FL. Orlando, Florida – April 25, 2023 – Brewer Science, Inc. and PulseForge, Inc. bring substantial…

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