Brewer Science to Acquire Semiconductor Chemical Business Line from Heraeus Epurio Rolla, MO — June 18, 2026 Brewer Science, Inc., a global leader in advanced materials and processes for the fabrication of cutting-edge microdevices, today announced it has entered into an agreement to acquire the semiconductor chemicals business line of Heraeus Epurio, a recognized technology…

Brewer Science Releases 2026 Impact Report, Marks Eleventh Consecutive Year of Zero Waste to Landfill Certification ESG progress, industry-first sustainability leadership and long-term governance goals Rolla, Mo. — June 8, 2026 — Brewer Science, a global leader in developing and manufacturing next-generation materials and technologies for the semiconductor industry, today released its 2026 Impact Report, detailing continued progress…

Brewer Science to Showcase Advanced Packaging Materials and Technologies at ECTC 2026 Orlando, Florida – May 18, 2026 — Brewer Science, Inc., a global leader in materials innovation for advanced packaging and semiconductor manufacturing, will be exhibiting and presenting at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), taking place May 26–29, 2026,…

Brewer Science Earns 2026 USA TODAY Top Workplaces Award Employee-Owner Feedback Recognizes Company’s People-First Culture Rolla, MO – April 14, 2026 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, has been named a 2026 USA TODAY Top Workplace. The recognition underscores Brewer…

Dr. Brewer Inducted into Missouri Manufacturers Hall of Fame Brewer Science’s Antireflective Coatings Receive Top Honor in Coolest Things Made in Missouri Rolla, MO. – March 5, 2026 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, is honored to announce that the…

300-mm Ultrathin Wafer Handling: Presentation Highlights High-Temperature-Stable Temporary Bonding and IR Laser Debonding with Si Carriers   Chemnitz, Germany. – December 2, 2025 – Brewer Science, in collaboration with EV Group (EVG) and Fraunhofer IZM ASSID, will co-present groundbreaking research on ultrathin wafer handling at WaferBond ’25 conference in Chemnitz, Germany. Fraunhofer ASSID will lead…

imec and Brewer Science to Co-Present Breakthroughs in Thin Interposer Assembly and Flash-Lamp Debonding at EPTC 2025   Singapore — November 25, 2025 — Brewer Science, Inc., a global leader in advanced packaging materials and processes, will co‑present two technical papers with imec at the IEEE Electronics Packaging Technology Conference (EPTC) in Singapore, December 2–5,…

Brewer Science’s Dr. Douglas Guerrero to Deliver Keynote at MNC 2025 in Japan Exploring how device and process integration have impacted material design   Tokyo, Japan. – November 18, 2025 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, is pleased to announce…

Brewer Science Expands U.S. Operations with New Chandler, Arizona Office and Lab Collaboration with semiconductor customers and research partners, access to talent among key considerations     CHANDLER, Arizona. – September 23, 2025 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, announces…

Participating in the Next-Generation Semiconductor Packaging Consortium "JOINT3" Brewer Science has joined the next-generation semiconductor packaging consortium "JOINT3." September 3, 2025 - JOINT3 is a co-creation evaluation platform established by Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level…