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February 28- March 2, 2017 San Jose, California Booth: 110 Molecular force modeling of lithography - Invited Paper Zhimin Zhu, Brewer Science, Inc. (United States) Session 4: 3D Resist Effects…
February 28 - March 2, 2017 Event Read MoreFebruary 10, 2017 – San Jose, CA – Brewer Science invites you to join us February 26 through March 2 at SPIE Advanced Lithography in San Jose, CA, as we…
Read MoreMultilayer technology from Brewer Science has allowed the industry to continue to push the limits of advanced lithography well into the future. Our experts explain why it was needed and…
Read MoreProTEK® Materials Highly oleophobic and hydrophobic transparent scratch-resistant coating.
Read MoreWhy do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and…
Read MoreWhat is "Fan-out Wafer-Level Packaging"? Fan-out wafer-level packaging (FOWLP) has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and…
Read MoreFebruary 15- 17, 2017 Tokyo, Japan Brewer Science is co-exhibiting with OE-A (Organic and Printed Electronics Association). Booth: 6B-28 Conference Website
Read MoreJanuary 19, 2017 – Belle, MO – Brewer Science is investing in the innovators of tomorrow by promoting opportunities for learning more about science, technology, engineering, and math (STEM) in…
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