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April 25-27, 2017 Penang, Malaysia SEMICON SEA (Southeast Asia) 2017: Semiconductor, Wafer-Level Packaging SPICE Arena Ram is presenting at the Advanced Packaging forum Wednesday, April 26: "Temporary…
April 25-27, 2017 Event Read MoreApril 20-21, 2017 Wuxi, China The Advanced Packaging Symposium is hosted and organized by Yole Développement and the National Center for Advanced Packaging (NCAP China). All aspects of Advanced…
Read MoreMarch 28-30, 2017 Munich, Germany Booth: 510 "High-Current Pulse Processing to Improve Stability and Hysterisis in CNT-based Printed Electronic Devices" Dr. Ryan Giedd Session: Functional Materials March 29th, 2017 |…
Read MoreDirected self-assembly (DSA) is an exciting new technology that uses specially designed block copolymers to form IC patterns on a molecular scale.
Read MoreMarch 12 - 13, 2017 Shanghai, China Shanghai International Convention Center "Molecular Force Modeling of Lithography" Zhimin Zhu, Senior Scientist, Brewer Science, Inc. - Invited speaker. Symposium II: Lithography and…
Read MoreUnderstanding Panel-Level Processing Ram Trichur explains how the transition from conventional wafers to large panels can generate significant cost savings for fan-out wafer-level packaging, and how these large, thin panels…
Read MoreMarch 7-8, 2017 Brussels, Belgium Ulrich Herleb "A Novel Approach To How The World Senses: Highly Sensitive, Real-time Response, Light-weight And Flexible Sensor Systems Tuesday, March 7, 2017 14:50…
Read MoreBrewer Science Inflect™ Flex Sensor InFlect™ flex sensors utilize our revolutionary carbon-based nanotechnology to deliver a highly sensitive and real-time response to varying angles of deflection.
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June 24, 2024
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