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Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference Austin, TX– April 7, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, is pleased to announce that Dr. Andrea Chacko, Director of Packaging Solutions R&D, will present at the 2025…
Event Read MorePrinted Electronics With Integrated Sensors to a New Way of 'Smart Living' Join Rob Frueh, Sr. Manager of Business Development at Brewer Science, and a panel of experts on the…
Read MoreLOPEC (Large-area, Organic & Printed Electronics Convention) is the leading trade fair and the most important congress for the printed electronics industry. The event usually takes place at Messe Munchen…
Read MoreSEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most…
Read MoreCSTIC 2021 is one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI, IMEC and IEEE-EDS, co-organized by IMECAS.…
Read MoreAs the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Industry and academic leaders come to solve challenges in…
Read MoreFLEX, the flexible hybrid electronics (FHE) go-to event, is the center of technical and informative demonstration of flexible hybrid, printed electronics products, equipment, processes, materials, and the applications they enable.…
Read MoreDr. Brewer presented at Missouri State University's Bicentennial Webinar Series: "Changing Lives Through Technology, Science and Innovation" on January 27th at 12pmCST. If you were unable to attend the virtual…
Read MoreOctober 22 & 23 CMC Conference preceded by CMC Meeting at Intel on October 20-21 Featuring Keynote: Bruce Tufts, VP Technology & Manufacturing Group, Director, Fab Materials, Intel Corp with…
Read MoreThe Next Wave of Sensorization: Solving Our Shared Challenges Industry economic, business updates will be covered from different aspects of the ecosystem, together with forward-looking strategic and technology trends. The…
Read MoreBridging the Boundaries: Wafer, Panel and Beyond October 13 - 15, 2020 DoubleTree by Hilton San Jose San Jose, California, USA The SMTA and Chip Scale Review are pleased to…
Read MoreMarch 31, 2025
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