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Brewer Science is exhibiting and presenting at SEMICON Taiwan 2024. Visit us at Booth# I2116 Featured Presentations: Recent Advances in Materials for Advanced Packaging New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging Additionally, Alvin Lee is a featured speaker on the Panel Discussion: Emerging Technology Requirement for High…
Event Read MoreDan Brewer will be presenting, "Driving Global Technology Advancements from Missouri" : Aug 19th at 1:10pmCT. Missouri is projected to be a top state for tech job growth in the…
Read Morehttps://youtu.be/YHo6LFOmYyg Rolla, Mo. August 3, 2021 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will be…
Read MoreThe 17th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly…
Read MoreBrewer Science is exhibiting a virtual booth and a sponsor of the TechBlick Year Round Event Series On Emerging Technologies. The 2021 event focus surrounds Electronics, Photovoltaics, Displays, Sensors, Printed,…
Read MorePrinted Electronics With Integrated Sensors to a New Way of 'Smart Living' Join Rob Frueh, Sr. Manager of Business Development at Brewer Science, and a panel of experts on the…
Read MoreLOPEC (Large-area, Organic & Printed Electronics Convention) is the leading trade fair and the most important congress for the printed electronics industry. The event usually takes place at Messe Munchen…
Read MoreSEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most…
Read MoreCSTIC 2021 is one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI, IMEC and IEEE-EDS, co-organized by IMECAS.…
Read MoreAs the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Industry and academic leaders come to solve challenges in…
Read MoreFLEX, the flexible hybrid electronics (FHE) go-to event, is the center of technical and informative demonstration of flexible hybrid, printed electronics products, equipment, processes, materials, and the applications they enable.…
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