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August 21-25, 2016 Event
American Chemical Society

August 21-25, 2016 Philadelphia, Pennsylvania

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July 12-14, 2016 Event
2016 SEMICON West

July 12-14, 2016 Moscone Center San Francisco, California   SEMICON West is an annual event built around keeping up with the latest disruptive trends driving today’s market. This event brings…

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June 12-15, 2016 Event
UGIM Symposium | Utah Nanofab

June 12-15, 2016 Salt Lake City, Utah

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June 7-9, 2016 Event
SEMICON Russia

June 7-9, 2016 Moscow, Russia

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May 31st - June 3rd, 2016 Event
ECTC

Presentation Friday, June 3rd · 2:20PM Session 36: 3D materials & Processing Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material" Alain Phommahaxay, Goedele…

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May 16-19, 2016 Event
CS ManTech

Compound Semiconductor Manufacturing 2016 See the next generation of temporary bonding equipment and thin wafer handling technology for SiC and compound semiconductor at the Brewer Science 2016 CS Mantech booth.…

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Event
EUV Lithography Symposium

October 24-26, 2016 Hiroshima, Japan http://euvl2016.org/ Please look for Tanti Ouattara's poster at 2016 International EUVL Symposium.

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June 10, 2020 Event
Best Practices for Virtual Internships Webinar

Best Practices for Virtual Internships Webinar Julie Littrell, Sr. HR Director at Brewer Science, joins a webinar discussing how employers can offer virtual internships and the benefits it carries Watch…

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July 2020 Event
2020 IEEE 70th  Electronic Components and Technology Conference

Brewer Science participated in the 2020 IEEE 70th  Electronic Components and Technology Conference (ECTC). Xiao Liu, Senior Program Manager at Brewer Science, presented 'Introduction of a New Carrier System for…

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Event
Laser Debonding in 2D and 3D Heterogeneous Applications featured in Chip Scale Review

Alice Guerrero, Senior Applications Engineer in Wafer-Level Packaging at Brewer Science, and Koen Kennes, Research and Development Engineer at imec, contributed to Chip Scale Review with a discussion of the…

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