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Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference Austin, TX– April 7, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, is pleased to announce that Dr. Andrea Chacko, Director of Packaging Solutions R&D, will present at the 2025…
Event Read MoreJune 19-22, 2017 Monterey, California Flexible and Printed Electronics Conference (FLEX) USA 2017: Printed Electronics Hyatt Regency Monterey Hotel & Spa Schedule a time to meet at the conference or…
Read MoreMay 30-June 3, 2017 Taipei Since 1981, COMPUTEX TAIPEI (also called COMPUTEX), has been the world’s leading B2B ICT/IoT (Internet of Things) trade show and developing into a global startup…
Read MoreMay 30-June 2, 2017 Lake Buena Vista, Florida Presentations Wednesday, May 31, 8:00-11:40 a.m. Session 1: Fan-Out Packaging Process and Integration 10:50 AM - Process Development and Material Characteristics of…
Read MoreMay 22-25, 2017 Indian Wells, CA [Palm Springs] Booth: 315 CS Mantech: Compound Semiconductor Manufacturing Technology Hyatt Regency Indian Wells Resort & Spa Featured products at CS Mantech:…
Read MoreMay 18, 2017 Seoul, Korea Strategic Materials Conference Korea (SMC Korea) 2017 Diamond Room, B1, InterContinental Seoul The 2nd Strategic Materials Conference (SMC) Korea 2017 will be held with…
Read MoreMay 11-12, 2017 Richardson, Texas About CMC: The Critical Materials Council (CMC) Conference is a two day event providing actionable information on materials and supply-chains for current and future…
Read MoreApril 25-27, 2017 Penang, Malaysia SEMICON SEA (Southeast Asia) 2017: Semiconductor, Wafer-Level Packaging SPICE Arena Ram is presenting at the Advanced Packaging forum Wednesday, April 26: "Temporary…
Read MoreApril 24-27, 2017 Hsinchu,Taiwan. VLSI-TSA Symposium Ambassador Hotel Hsinchu, Taiwanj The 2017 International Symposium on VLSI Technology, Systems and Applications (2017 VLSI-TSA) will be held on April 24-27, 2017 at the…
Read MoreApril 20-21, 2017 Wuxi, China The Advanced Packaging Symposium is hosted and organized by Yole Développement and the National Center for Advanced Packaging (NCAP China). All aspects of Advanced…
Read MoreMarch 28-30, 2017 Munich, Germany Booth: 510 "High-Current Pulse Processing to Improve Stability and Hysterisis in CNT-based Printed Electronic Devices" Dr. Ryan Giedd Session: Functional Materials March 29th, 2017 |…
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