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Brewer Science is exhibiting and presenting at SEMICON Taiwan 2024. Visit us at Booth# I2116 Featured Presentations: Recent Advances in Materials for Advanced Packaging New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging Additionally, Alvin Lee is a featured speaker on the Panel Discussion: Emerging Technology Requirement for High…
Event Read MoreDecember 13-15, 2016 San Francisco, CA Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California. Presentation: Temporary Wafer Bonding Technology…
Read MoreNovember 16-17, 2016 Santa Clara, California Booth: T19 Presentation: Carbon Nanomaterials: Defining the Future of High-Speed Printed Sensors Time: November 16th, 2016 | 13:55 - 14:15 By: Nick Anthony and Rob Frueh…
Read MoreOctober 30- November 2nd, 2016 Orlando, Florida http://ieee-sensors2016.org/ Come check out our InflectTM sensors demos at booth 12
Read MoreOctober 11-13, 2016 Leti Grenoble, France http://www.dsasymposium.org/index.php/homepage/venue This symposium on directed self-assembly (DSA) will be held in Grenoble, France and will include presentations and exhibits featuring materials, processing, DSA-friendly design,…
Read MoreSeptember 28th, 2016 Fayetteville, Arkansas
Read MoreSeptember 27th, 2016 Rolla, Missouri
Read MoreSeptember 20-21, 2016 Computer History Museum Mountain View, California http://www.semi.org/en/node/41386 The theme for this year’s Strategic Materials Conference (SMC) is Scaling Challenges: The Future of Materials and Packaging. What is…
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