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Brewer Science is exhibiting and presenting at SEMICON Taiwan 2024. Visit us at Booth# I2116 Featured Presentations: Recent Advances in Materials for Advanced Packaging New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging Additionally, Alvin Lee is a featured speaker on the Panel Discussion: Emerging Technology Requirement for High…
Event Read MoreFebruary 25 – March 2, 2018 Booth #: 110 San Jose Convention Center San Jose, California Speaker Information: Presenter: Zhimin Zhu Time: Tuesday, February 27th: 10:30AM – 12:10PM Optical Microlithography…
Read MoreFebruary 12-15, 2018 Hyatt Regency Monterey, California Description: Flex 2018, a SEMI organization event in collaboration with MEMS & Sensors Technical Congress (MSTC) in Monterey, California, will be the…
Read MoreJanuary 28-31, 2018 Messe Munchen Munich, Germany Description: ISPO is the world’s leading sports business trade fair. Gathering the major brands, suppliers, and innovators for sports technology into one area…
Read MoreDecember 13-15, 2017 Booth: 3209 Tokyo, Japan SEMICON Japan: Semiconductor, Wafer-Level Packaging Tokyo, Japan For more information contact us at info@brewerscience.com or fill out the below form: For more information:…
Read MoreDecember 6-9, 2017 Singapore, Grand Copthorne Waterfront Hotel Brewer Science’s Ram Trichur, Business Development Director, to present an invited talk at EPTC: Invited-08: Temporary Bonding Materials for Fan-out Packaging Processes…
Read MoreTuesday, December 5, 2017 San Francisco, CA, USA Brewer Science’s Kim Yess, Business Technology Director, Wafer-Level Packaging Materials Division, to discuss The Evolution of Substrate Build-up and Thin Wafer…
Read MoreOctober 29-November 2, 2017 Tampa, FL Don’t miss our presentation Materials and Methods for Bottom-Up Semiconductor Device Manufacturing by Selective Surface Modification, Reuben Chacko, J. Lowes, J. Dai, S. Brown,…
Read MoreOctober 24-26, 2017 San Jose, CA Double Tree by Hilton San Jose Attend our presentation at Wafer Level Packaging (WLP) Processes Session 4 The Dual-layer Bonding Platform as A Technical…
Read MoreOctober 9-12, 2017 Raleigh, NC Attend our joint paper with SUSS MicroTec Ablative Laser Patterning of Polymeric Dielectric Materials Author(s): Cristina Matos, Brewer Science, Inc. (Deborah Blumenshine, Lisa Kirchner, Rama…
Read MoreSeptember 27-29, 2017 Barcelona, Spain Don’t miss the opportunity to attend our Sensors Applications session presentation Sensor Excitation and Measurement Techniques for CNT Thin-Film Sensors Louis McCarthy, Brewer Science…
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