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The microelectronics industry is rapidly migrating to fabricating 3-D wafer stacking interconnects using through-silicon via (TSV) technology. Major market segments seeking to benefit from TSV technology include advanced packaging for…
October 15, 2018 Blogs Read MoreThin-wafer processing trends Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these fragile materials is paramount and requires…
Read MoreThermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage…
Read MoreIn its constant quest to innovate, Brewer Science is continually on the cutting edge of what is next. We are currently combining directed self-assembly (DSA) and lithography to achieve sub–10…
Read MoreIn recognition of its progress with temporary bonding and thin wafer handling, Brewer Science was featured in the November/December issue of Chip Scale Review. The feature discusses the company’s use…
Read MoreThe Internet of Things (IoT) includes a number of different applications throughout a wide assortment of industries. In our first breakdown of applications within the IoT, we discussed how Brewer…
Read MoreThe Internet of Things (IoT) has made substantial strides since first being envisioned in 1999, having moved beyond machine-to-machine communications, toward impacting a variety of industries with “smart” devices. Nearly…
Read MoreAnyone who has worked in a fancy restaurant can tell you that the small details make the biggest impact. The food has to be perfect, yes. But even a simple…
Read MoreJanuary 16 - 17, 2025 • Silicon Valley, California [+]
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