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How Temporary Bonding Works Learn how temporary bonding and ultra-thin wafers are being used to create smaller and faster electronic devices. Check out our temporary bonding materials here
Click Here to Read MoreDirected self-assembly (DSA) is an exciting new technology that uses specially designed block copolymers to form IC patterns on a molecular scale.
Click Here to Read MoreUnderstanding Panel-Level Processing Ram Trichur explains how the transition from conventional wafers to large panels can generate significant cost savings for fan-out wafer-level packaging, and how these large, thin panels pose new challenges for handling and processing. Learn more about our Wafer-Level Packaging developments here.
Click Here to Read MoreBrewer Science Inflect™ Flex Sensor InFlect™ flex sensors utilize our revolutionary carbon-based nanotechnology to deliver a highly sensitive and real-time response to varying angles of deflection.
Click Here to Read MoreMultilayer technology from Brewer Science has allowed the industry to continue to push the limits of advanced lithography well into the future. Our experts explain why it was needed and how it eventually became the industry standard for leading-edge semiconductor manufacturing.
Click Here to Read MoreProTEK® Materials Highly oleophobic and hydrophobic transparent scratch-resistant coating.
Click Here to Read MoreWhy do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and packaging steps. Thinning the wafers before the chips are packaged allows for thinner electronic devices and overall better performance Check out our temporary bonding materials…
Click Here to Read MoreWhat is "Fan-out Wafer-Level Packaging"? Fan-out wafer-level packaging (FOWLP) has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and ease of integration using conventional wafer fab equipment. In this video, Ram Trichur describes a typical FOWLP process flow and the challenge of handling the…
Click Here to Read Morehttps://www.youtube.com/watch?v=bglxxfQyaFk Brewer Science InFlect™ Sensors In an industry where milliseconds count, contact a Brewer Science expert to start monitoring and understanding your process better.
Click Here to Read MoreHigh-Speed Temperature Sensing in Roll-to-Roll Processing Brewer Science printed thermistors are among the fastest on the market, are highly accurate, and can operate at extremely low power, due to a revolutionary carbon nanotechnology design. InFlectTM thermistors utilize our revolutionary carbon-based nanotechnology to deliver highly accurate and real-time response to small changes in temperature.
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