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Matthew Beard, Director of Integrated Management Systems at Brewer Science, shares his expert insight creating sustainability strategies and implementing environmental programs in the semiconductor industry. Join us for this webinar focusing on two of the biggest business issues facing managers today 1. how to responsibly create sustainability strategies; and, 2. how to find and…
Click Here to Read MoreDouglas Guerrero will be presenting Roles of Underlayers in Novel Patterning for EUV Lithography, and Zhimin Zhu will be presenting Suppressing Stochastic Interaction to Improve EUV Lithography at CSTIC, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI and IEEE-EDS, co-organized by IMECAS,…
Click Here to Read MoreShelly Fowler will be presenting, A Novel Photosensitive Permanent Bonding Material Designed for Polymer/Metal Hybrid Bonding Applications at CS Mantech. She will be apart of session 12: Integrations & Packaging on Wednesday May 11th at 5:10pmPST. Brewer Science is sponsoring the swag bags at this event. Learn more
Click Here to Read MoreThe Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. In addition to Brewer Science being a panel session sponsor at…
Click Here to Read MoreBrewer Science will be exhibiting at the SMC (Strategic Materials Conference) Korea 2022. Check out our virtual booth to learn more about our innovative approach to EUV lithography. Yichen Liang will be presenting, Application of spin-on-glass underlayer on printing high-resolution line/space and contact hole patterning using extreme ultraviolet lithography. His presentation is featured in the…
Click Here to Read MoreRama Puligadda will be presenting New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging at the CMC Conference. Brewer Science is a "Coffee Break Sponsor" at this event. CMC is a technical event, providing actionable information on materials and supply chains for current and future semiconductor manufacturing. Learn more
Click Here to Read MoreAs the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Jakub Kosa will be presenting, High-temperature stable spin-on carbon materials for advanced pattern transfer applications. Yichen Liang will be presenting, Realization of sub-30 pitch EUV Lithography through the application of functional spin-on glass. Learn…
Click Here to Read MoreBaron Huang, Mei Dong, Shelly Fowler, Andrea Chacko, and Rama Puligadda contributed to Chip Scale Review with a discussion of Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material. Downscaling is a never-ending task for the semiconductor industry to meet the ever-increasing electronic system demands for higher performance and functionality, smaller system form factor,…
Click Here to Read MoreBrewer Science enjoys partnering with community organizations to provide an annual recycling event for the community to conveniently recycle their residential electronics and tires, diverting a significant amount of waste from our landfills. The 2024 recycling event will take place June 8th, below is the detailed information regarding which items can be recycled…
Click Here to Read MoreWhite at SEMICON West, Rama Puligadda, Kim Arnold, and Alex Smith sat down with Francoise von Trapp with 3D Incites to talk on her podcast about the company’s growth, its strength in culture as they navigated through the pandemic, about the company’s efforts to foster tenure, helping employees to grow in their career paths, and…
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