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Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material featured in Chip Scale Review

Baron Huang, Mei Dong, Shelly Fowler, Andrea Chacko, and Rama Puligadda contributed to Chip Scale Review with a discussion of Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material. Downscaling is a never-ending task for the semiconductor industry to meet the ever-increasing electronic system demands for higher performance and functionality, smaller system form factor,…

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Electronics, Appliance & Tire Collection - 2024 Recycling Event at Brewer Science

    Brewer Science enjoys partnering with community organizations to provide an annual recycling event for the community to conveniently recycle their residential electronics and tires, diverting a significant amount of waste from our landfills. The 2024 recycling event will take place June 8th, below is the detailed information regarding which items can be recycled…

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SEMICON West 2021

White at SEMICON West, Rama Puligadda, Kim Arnold, and Alex Smith sat down with Francoise von Trapp with 3D Incites to talk on her podcast about the company’s growth, its strength in culture as they navigated through the pandemic, about the company’s efforts to foster tenure, helping employees to grow in their career paths, and…

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2021 Brewer Science Hosts Pure Enjoyment Art Exhibit Virtual and In-Person

2021 Brewer Science Hosts Pure Enjoyment Art Exhibit Virtual and In-Person [caption id="attachment_8670" align="alignright" width="193"] Forest Greens - Morgan Bippes[/caption] Springfield, MO - November 1, 2021 – Brewer Science, in cooperation with the Springfield Regional Arts Council, hosted an exhibit featuring original art and photography during October. This year’s Pure Enjoyment Art Exhibit in-person show…

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Manufacturing Day 2021

    Brewer Science is hosting a virtual Manufacturing Day featuring local Missouri manufacturers through videos and a live Q&A discussion. This free event is open to students, job seekers, and anyone interested in learning more about manufacturing. To attend the virtual Manufacturing Day on Friday, October 15 at 10am CT,  please use the form…

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Chief Resource Officer Dan Brewer Set to Deliver Keynote Speech at Tech and Innovation Summit

Chief Resource Officer Dan Brewer Set to Deliver Keynote Speech at Tech and Innovation Summit Remarks Highlight Missouri's Robust Technological Advancements https://youtu.be/hMrs2M_Oeko   ROLLA, Mo., Aug. 18, 2021  -- Brewer Science's Chief Resource Officer Dan Brewer is slated to address the Missouri Chamber of Commerce and Industry's virtual Tech and Innovation Summit on August 19.…

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Missouri Tech & Innovation Virtual Summit

Dan Brewer will be presenting, "Driving Global Technology Advancements from Missouri" : Aug 19th at 1:10pmCT. Missouri is projected to be a top state for tech job growth in the coming decade. This inaugural event — organized by the Missouri Chamber of Commerce and Industry — will unleash the potential of the Missouri Technology Alliance…

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Brewer Science Demonstrates Smart Devices & Printed Electronics Capabilities at Innovation Days

  https://youtu.be/YHo6LFOmYyg Rolla, Mo. August 3, 2021 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will be demonstrating its smart devices and printed electronics capabilities at the NextFlex Innovation Days 2021, an international industry showcase held virtually August 3rd through August 5th.…

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TechBlick Year Round Event Series On Emerging Technologies

Brewer Science is exhibiting a virtual booth and a sponsor of the TechBlick Year Round Event Series On Emerging Technologies. The 2021 event focus surrounds Electronics, Photovoltaics, Displays, Sensors, Printed, Flexible, Hybrid, Roll-to-Roll, Structural,  InMold, 3D, Conformal, Large-Area, Stretchable, Textile, Wearable, Patches, Transparent. As well as Material Innovations, such as Energy Storage Materials, Graphene and…

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IMAPS Device Packaging Conference 2021

The 17th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting…

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