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December 13-15, 2016 San Francisco, CA Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California. Presentation: Temporary Wafer Bonding Technology for Advanced Packaging Session: Equipment and Materials 4:40PM - 5:00PM | Wednesday, December 14th, 2016 Dongshun Bai, Brewer Science Emerging Brewer Science Technologies at 3D…
Click Here to Read MoreNovember 16-17, 2016 Santa Clara, California Booth: T19 Presentation: Carbon Nanomaterials: Defining the Future of High-Speed Printed Sensors Time: November 16th, 2016 | 13:55 - 14:15 By: Nick Anthony and Rob Frueh This is the world’s largest event for printed and flexible electronics. This event, featuring more than 225 exhibitors from around the globe, is attended by…
Click Here to Read MoreOctober 30- November 2nd, 2016 Orlando, Florida http://ieee-sensors2016.org/ Come check out our InflectTM sensors demos at booth 12
Click Here to Read MoreOctober 24-26, 2016 Hiroshima, Japan http://euvl2016.org/ Please look for Tanti Ouattara's poster at 2016 International EUVL Symposium.
Click Here to Read MoreOctober 11-13, 2016 Leti Grenoble, France http://www.dsasymposium.org/index.php/homepage/venue This symposium on directed self-assembly (DSA) will be held in Grenoble, France and will include presentations and exhibits featuring materials, processing, DSA-friendly design, etch, simulations, 2D and 3D metrology, pattern placement, integration, and DSA extendibility. This event is designed to be a mix of industrial and academic contributors…
Click Here to Read MoreSeptember 27th, 2016 Rolla, Missouri
Click Here to Read MoreSeptember 20-21, 2016 Computer History Museum Mountain View, California http://www.semi.org/en/node/41386 The theme for this year’s Strategic Materials Conference (SMC) is Scaling Challenges: The Future of Materials and Packaging. What is driving the demand for new materials? How will material suppliers be impacted? How does this effect the future of scaling for materials and packaging? Please…
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