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April 25-27, 2017 Penang, Malaysia SEMICON SEA (Southeast Asia) 2017: Semiconductor, Wafer-Level Packaging SPICE Arena Ram is presenting at the Advanced Packaging forum Wednesday, April 26: "Temporary Bonding Technologies for Advanced Fan-Out Wafer Level Packaging Applications" 16:20-16:45, Mr. Ramachandran K. TRICHUR, Director, Business Development, Brewer Science Inc, USA Schedule a time…
Click Here to Read MoreApril 24-27, 2017 Hsinchu,Taiwan. VLSI-TSA Symposium Ambassador Hotel Hsinchu, Taiwanj The 2017 International Symposium on VLSI Technology, Systems and Applications (2017 VLSI-TSA) will be held on April 24-27, 2017 at the Ambassador Hotel Hsinchu,Taiwan. Organized by Industrial Technology Research Institute (ITRI) and technically co-sponsored by IEEE, VLSI-TSA creates an annual platform for technical exchanges by experts…
Click Here to Read MoreApril 20-21, 2017 Wuxi, China The Advanced Packaging Symposium is hosted and organized by Yole Développement and the National Center for Advanced Packaging (NCAP China). All aspects of Advanced Packaging, including Fan Out Packaging, System in Package, Advanced Substrates, 3D Technology & Embedded Technologies, as well as MEMS & Sensors packaging, RF, and Photonics…
Click Here to Read MoreMarch 28-30, 2017 Munich, Germany Booth: 510 "High-Current Pulse Processing to Improve Stability and Hysterisis in CNT-based Printed Electronic Devices" Dr. Ryan Giedd Session: Functional Materials March 29th, 2017 | 12:30 - 12:50 Room 13b Brewer Science will be showcasing their Inflect™ thermistor, moisture, and flex sensors line at LOPE-C. Schedule a time to meet…
Click Here to Read MoreMarch 12 - 13, 2017 Shanghai, China Shanghai International Convention Center "Molecular Force Modeling of Lithography" Zhimin Zhu, Senior Scientist, Brewer Science, Inc. - Invited speaker. Symposium II: Lithography and Patterning Session VI: Process & Material Meeting Room: 3rd Floor Yellow River Hall Sunday, March 12, 2017 16:55-17.15
Click Here to Read MoreMarch 7-8, 2017 Brussels, Belgium Ulrich Herleb "A Novel Approach To How The World Senses: Highly Sensitive, Real-time Response, Light-weight And Flexible Sensor Systems Tuesday, March 7, 2017 14:50 For more information on Ulrich and the IoT International Conference check out their conference website.
Click Here to Read MoreFebruary 28- March 2, 2017 San Jose, California Booth: 110 Molecular force modeling of lithography - Invited Paper Zhimin Zhu, Brewer Science, Inc. (United States) Session 4: 3D Resist Effects and Modeling Tuesday, February 28th 2017 4:10 - 6:00 PM Location: Convention Center 220C Highχ block copolymers for directed self-assembly patterning without the need for…
Click Here to Read MoreFebruary 15- 17, 2017 Tokyo, Japan Brewer Science is co-exhibiting with OE-A (Organic and Printed Electronics Association). Booth: 6B-28 Conference Website
Click Here to Read MoreJanuary 8-11, 2017 Half Moon Bay, California Brewer Science is proud to sponsor two sessions at the 2017 SEMI ISS. The first is the keynote session entitled ‘Data Center: Innovation, Opportunity and Growth’ on Tuesday, January 10th beginning at 8:00 AM and the second is Session 3 on 'Technology' which will immediately follow the keynote…
Click Here to Read MoreDecember 14-16, 2016 Tokyo, Japan Booth: 3408 SEMICON Japan is the premier exposition for microelectronics manufacturing supply chain. Brewer Science products will be on display at our booth. Emerging Brewer Science Technologies at SEMICON Japan Wafer-Level Packaging Directed-Self Assembly Multilayer Systems Conference Website: http://www.semiconjapan.org Request More Information
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