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September 13-15, 2017 Tokyo, Japan Sensor Expo Japan: Printed Electronics Tokyo Big Sight - East Hall Organizer： Fuji Sankei Business i. (The Nihon Kogyo Shimbun Co., Ltd.) Special Sponsor： Japan Society of Next Generation Sensor Technology Schedule a time to meet at the conference or ask a question about a featured product: For…
Click Here to Read MoreTaipei Nangang Exhibition Center Taipei, Taiwan Booth 280 Join Brewer Science at the largest microelectronic event in Taiwan Brewer Science is proud to be a part of the largest microelectronic event in Taiwan. We encourage you to stop by booth 280 to see how our products enrich the lives of others. Our booth will be…
Click Here to Read MoreJuly 11-13, 2017 San Francisco, California 2017 SEMICON West: Printed Electronics, Semiconductor, Wafer-Level Packaging Moscone Center Schedule a time or ask a question about a feature product: For more information: Semicon Website
Click Here to Read MoreJune 27-29, 2017 San Jose, CA McEnery Convention Center Booth: 1334 The Premier Event for Sensors and Sensing Technologies For over 30 years, Sensors Expo & Conference has established itself as North America's premier event focused exclusively on sensors and sensor-integrated systems. The 2017 event will be taking place June 27-29 at the McEnery Convention Center…
Click Here to Read MoreJune 19-22, 2017 Monterey, California Flexible and Printed Electronics Conference (FLEX) USA 2017: Printed Electronics Hyatt Regency Monterey Hotel & Spa Schedule a time to meet at the conference or ask a question about a featured product: For more information: Conference Website
Click Here to Read MoreMay 30-June 3, 2017 Taipei Since 1981, COMPUTEX TAIPEI (also called COMPUTEX), has been the world’s leading B2B ICT/IoT (Internet of Things) trade show and developing into a global startup platform. While evolving in sync with global ICT industry trend, COMPUTEX 2017 positions itself as Building Global Technology Ecosystems, focusing on 5 main themes: AI…
Click Here to Read MoreMay 30-June 2, 2017 Lake Buena Vista, Florida Presentations Wednesday, May 31, 8:00-11:40 a.m. Session 1: Fan-Out Packaging Process and Integration 10:50 AM - Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP Wen-Wei Shen, Yu-Min Lin, Sheng-Tsai Wu, Hsiang-Hung Chang, Tao-Chih Chang, and Ang-Ying Lin – ITRI; Alvin Lee, Jay Su, and…
Click Here to Read MoreMay 22-25, 2017 Indian Wells, CA [Palm Springs] Booth: 315 CS Mantech: Compound Semiconductor Manufacturing Technology Hyatt Regency Indian Wells Resort & Spa Featured products at CS Mantech: BrewerBOND® 220 Material BrewerBOND® 305 Material BrewerBOND® 510 Material BrewerBOND® 701 Material WaferBOND® HT-10.10 Material WaferBOND® CR-200 Material Schedule a time or ask a question…
Click Here to Read MoreMay 18, 2017 Seoul, Korea Strategic Materials Conference Korea (SMC Korea) 2017 Diamond Room, B1, InterContinental Seoul The 2nd Strategic Materials Conference (SMC) Korea 2017 will be held with a theme of "Scaling Challenges – The Future of Materials". The conference will cover: Material Challenges in Future Memory Market Forecast EUV, Cleaning and Packaging…
Click Here to Read MoreMay 11-12, 2017 Richardson, Texas About CMC: The Critical Materials Council (CMC) Conference is a two day event providing actionable information on materials and supply-chains for current and future semiconductor manufacturing. Conference speakers provide information on critical materials used in HVM fabs and look at manufacturing integration issues associated with new materials needed for…
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