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In addition to precisely controlling application of the materials that enable wafer bonding, a solvent-enriched sealed spin chamber contributes to process integrity. One of the most critical variables in achieving optimal uniformities at the desired target thickness is airflow dynamics. Ideal conditions are created in a sealed chamber with a prewet solvent nozzle, a backside…
Click Here to Read MoreThe microelectronics industry is rapidly migrating to fabricating 3-D wafer stacking interconnects using through-silicon via (TSV) technology. Major market segments seeking to benefit from TSV technology include advanced packaging for memory/logic, light-emitting diodes (LEDs), and compound semiconductor (III-V) high-power radio-frequency (RF) devices. In this cutting-edge technology, fragile device substrates are bonded to carrier substrates with…
Click Here to Read MoreDeveloping photosensitive film layers to produce features of targeted sizes is a critical process step within any photolithography application. Application engineers have created several processes for performing this step with tank immersion (that is, a bath) and/or several adaptations of spin developing a single wafer to make patterns of features based on film areas of…
Click Here to Read MoreIn its constant quest to innovate, Brewer Science is continually on the cutting edge of what is next. We are currently combining directed self-assembly (DSA) and lithography to achieve sub–10 nm nanostructures. DSA uses block copolymers to generate arrays of self-assembled shapes such as lines or cylinders; the spatial arrangements of the resulting features can…
Click Here to Read MoreIn recognition of its progress with temporary bonding and thin wafer handling, Brewer Science was featured in the November/December issue of Chip Scale Review. The feature discusses the company’s use of wafer-level packaging (WLP) technologies in semiconductor segments, including fan-out WLP (FOWLP); fan-in wafer-level chip-scale package (FI-WLCSP); 3-D FOWLP; 2.5-D integration with interposer technology; and…
Click Here to Read MoreThe Internet of Things (IoT) includes a number of different applications throughout a wide assortment of industries. In our first breakdown of applications within the IoT, we discussed how Brewer Science creates materials for sensors and MEMS devices essential to the development of IoT applications. Now we’ll take a look at our involvement with control…
Click Here to Read MoreThe Internet of Things (IoT) has made substantial strides since first being envisioned in 1999, having moved beyond machine-to-machine communications, toward impacting a variety of industries with “smart” devices. Nearly 26 billion devices will be connected to the IoT by 2020, according to technology research firm Gartner, Inc., and the majority of these devices fit…
Click Here to Read MoreAnyone who has worked in a fancy restaurant can tell you that the small details make the biggest impact. The food has to be perfect, yes. But even a simple thing such as the way the napkins are folded or how often your water is refilled can make a lasting impression on the patrons. Oftentimes,…
Click Here to Read MoreBack in the day, Rama Puligadda came close to becoming a medical doctor, but a venture into chemistry led her down a different path. Today the native of New Delhi, India, holds an impressive three separate master’s degrees focusing on chemistry, polymer engineering/technology, and chemical engineering. But her motivation to learn hasn’t slowed. “Learning…
Click Here to Read MoreWhoever first coined the cliché “Don’t sweat the small stuff” didn’t work in nanotechnology. It’s a phrase that helps us put things into perspective. But if you’re in the compound semiconductor industry and measure things in micrometers, the small stuff is the only stuff worth sweating. There are two general obstacles that IC manufacturers struggle…
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