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Understanding Panel-Level Processing Ram Trichur explains how the transition from conventional wafers to large panels can generate significant cost savings for fan-out wafer-level packaging, and how these large, thin panels pose new challenges for handling and processing. Learn more about our Wafer-Level Packaging developments here.
Click Here to Read MoreBrewer Science Inflect™ Flex Sensor InFlect™ flex sensors utilize our revolutionary carbon-based nanotechnology to deliver a highly sensitive and real-time response to varying angles of deflection.
Click Here to Read MoreMultilayer technology from Brewer Science has allowed the industry to continue to push the limits of advanced lithography well into the future. Our experts explain why it was needed and how it eventually became the industry standard for leading-edge semiconductor manufacturing.
Click Here to Read MoreProTEK® Materials Highly oleophobic and hydrophobic transparent scratch-resistant coating.
Click Here to Read MoreWhy do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and packaging steps. Thinning the wafers before the chips are packaged allows for thinner electronic devices and overall better performance Check out our temporary bonding materials…
Click Here to Read MoreWhat is "Fan-out Wafer-Level Packaging"? Fan-out wafer-level packaging (FOWLP) has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and ease of integration using conventional wafer fab equipment. In this video, Ram Trichur describes a typical FOWLP process flow and the challenge of handling the…
Click Here to Read MoreJanuary 8-11, 2017 Half Moon Bay, California Brewer Science is proud to sponsor two sessions at the 2017 SEMI ISS. The first is the keynote session entitled ‘Data Center: Innovation, Opportunity and Growth’ on Tuesday, January 10th beginning at 8:00 AM and the second is Session 3 on 'Technology' which will immediately follow the keynote…
Click Here to Read MoreNovember 16-17, 2016 Santa Clara, California Booth: T19 Presentation: Carbon Nanomaterials: Defining the Future of High-Speed Printed Sensors Time: November 16th, 2016 | 13:55 - 14:15 By: Nick Anthony and Rob Frueh This is the world’s largest event for printed and flexible electronics. This event, featuring more than 225 exhibitors from around the globe, is attended by…
Click Here to Read MoreNovember 08, 2016 – Santa Clara, CA – The technical team at Brewer Science will be showcasing new sensor technology featuring Brewer Science devices at Printed Electronics USA, which is a part of the IDTechEx Exhibit, November 16-17 in Santa Clara, CA. Printed Electronics USA 2016 has a reputation for showcasing tomorrow’s technology today and…
Click Here to Read Morehttps://www.youtube.com/watch?v=bglxxfQyaFk Brewer Science InFlect™ Sensors In an industry where milliseconds count, contact a Brewer Science expert to start monitoring and understanding your process better.
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