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Materials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024 Experience higher integration density and improved performance through hybrid bonding techniques. Boston, MA – September 24, 2024 – Brewer Science, Inc., a pioneer in temporary bonding and materials for the semiconductor industry, is presenting Materials for Hybrid Bonding at IMAPS Symposium 2024…
Click Here to Read MoreImplementation of New Materials and Printed Electronics for Monitoring the Environment Presented at TechBlick in Boston Cost-effective, reliable, and scalable environmental monitoring solutions require Additively Manufactured Electronics (AME). Boston, MA – June 10, 2024 – Brewer Science, Inc., a pioneer in printed electronics and smart device technology, will be presenting Implementation of New Materials…
Click Here to Read MoreBrewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Ninth Consecutive Year Brewer Science is the first and only company in the semiconductor industry with GreenCircle Certification Rolla, Mo.– April 3, 2024–Brewer Science, a global technology leader, is pleased to announce it has earned Zero Waste to Landfill Certification for the ninth…
Click Here to Read MoreBrewer Science Earns Intel’s 2024 EPIC Distinguished Supplier Award Brewer Science is one of only 27 Distinguished Award recipients across Intel’s global supply chain. Rolla, MO, March 28, 2024 – Brewer Science is proud to announce that it has earned Intel’s EPIC Distinguished Supplier Award. Through its dedication to Excellence, Partnership, Inclusion, and Continuous…
Click Here to Read MoreBrewer Science Unveils Innovative Smart Warehouse Monitor System at IWLA Industry Event On-demand, actionable insight increases warehouse productivity and maximizes employee safety Rolla, MO – April 17, 2024 – Brewer Science, Inc., a pioneering leader in smart device technology, proudly introduces its latest innovation in workplace safety and productivity enhancement – the Smart Warehouse…
Click Here to Read MoreBrewer Science Co-presents Low-Temperature Hybrid Bonding Breakthroughs at ECTC Experience higher integration density and improved performance through hybrid bonding techniques. Denver, Colorado – May 23, 2024 – Brewer Science, Inc., a pioneer in temporary and hybrid bonding materials for the advanced packaging semiconductor industry, is presenting and exhibiting at Electronic Components and Technology Conference…
Click Here to Read MoreBrewer Science Presents Innovative Material Solutions for Compound Semiconductor Manufacturing at CS Mantech. Tucson, AZ – May 15, 2024 – Brewer Science, a global technology leader in specialty materials for compound semiconductor manufacturing, invites attendees of CS Mantech to visit Booth 316 to explore cutting-edge material solutions designed to address the unique challenges of compound…
Click Here to Read MoreBrewer Science is featured in The Wall Street Journal article, "American Manufacturers Seek Perfection as Quality Issues Mount" published on March 18, 2024. You can view the full article here. (subscription required) The Wall Street Journal business reporter, John Keilman, starts the article with an intriguing thought: "Imagine a world in which every product that…
Click Here to Read MoreBrewer Science presents innovative materials and processes at SPIE Advanced Lithography Conference 2024 San Jose, CA – February 21, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, presents material advancements and innovative processes at leading semiconductor event SPIE Advanced Lithography…
Click Here to Read MoreBrewer Science Presents High-refractive-index Polymers with High Transparency at SPIE AR VR MR 2024 San Francisco, CA – January 29, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, presents solutions to optical integration challenges at the SPIE AR VR MR…
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