Dr. Terry Brewer’s discovery of anti-reflective coatings resulted in a revolution in the global microelectronics industry and ushered in today’s high-speed, lightweight electronic devices.
Learn MoreAdvanced materials for the protection and enhancement of optics, displays, and other microelectronics.
Learn MoreOur line of products stretches across the whole spectrum of lithography wavelengths and is the most comprehensive product lineup in the industry.
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Learn MoreBrewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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Dan Brewer will be presenting, "Driving Global Technology Advancements from Missouri" : Aug 19th at 1:10pmCT. Missouri is projected to be a top state for tech job growth in the coming decade. This inaugural event — organized by the Missouri Chamber of Commerce and Industry — will unleash the potential of the Missouri Technology Alliance…
Click Here to Read MoreBrewer Science is exhibiting a virtual booth and a sponsor of the TechBlick Year Round Event Series On Emerging Technologies. The 2021 event focus surrounds Electronics, Photovoltaics, Displays, Sensors, Printed, Flexible, Hybrid, Roll-to-Roll, Structural, InMold, 3D, Conformal, Large-Area, Stretchable, Textile, Wearable, Patches, Transparent. As well as Material Innovations, such as Energy Storage Materials, Graphene and…
Click Here to Read MoreThe 17th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting…
Click Here to Read MoreLOPEC (Large-area, Organic & Printed Electronics Convention) is the leading trade fair and the most important congress for the printed electronics industry. The event usually takes place at Messe Munchen convention center in Germany,but this will be the first year it's held virtually! It is the leading global platform in the industry and provides support…
Click Here to Read MoreSEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China. SEMICON China will be held on March 17-19, 2021 in Shanghai, China, (and virtual) in conjunction with CSTIC…
Click Here to Read MoreCSTIC 2021 is one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI, IMEC and IEEE-EDS, co-organized by IMECAS. CSTIC 2021 will be held on March 14-15, 2021 in Shanghai, China, in conjunction with SEMICON China 2021. Virtual conference will be held on March…
Click Here to Read MoreFLEX, the flexible hybrid electronics (FHE) go-to event, is the center of technical and informative demonstration of flexible hybrid, printed electronics products, equipment, processes, materials, and the applications they enable. As the premier information-gathering and networking conference for industry stakeholders, and the FHE community, FLEX gathers 550+ executives, product managers, business development professionals, and engineering…
Click Here to Read MoreAs the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Industry and academic leaders come to solve challenges in lithography, patterning technologies, and unique materials, while sharing the latest advancements in the semiconductor industry. Check out our virtual booth here. https://youtu.be/B92S2vT4iro
Click Here to Read MoreDr. Brewer presented at Missouri State University's Bicentennial Webinar Series: "Changing Lives Through Technology, Science and Innovation" on January 27th at 12pmCST. If you were unable to attend the virtual event, you can watch a recording here: https://youtu.be/EwuHsMpAlWc
Click Here to Read MoreAlice Guerrero, Senior Applications Engineer in Wafer-Level Packaging at Brewer Science, and Koen Kennes, Research and Development Engineer at imec, contributed to Chip Scale Review with a discussion of the fundamentals of laser debonding and the advantages it has for 2D and 3D heterogeneous integration. Brewer Science and imec have several different products and programs…
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