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May 30-June 2, 2017 Lake Buena Vista, Florida Presentations Wednesday, May 31, 8:00-11:40 a.m. Session 1: Fan-Out Packaging Process and Integration 10:50 AM - Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP Wen-Wei Shen, Yu-Min Lin, Sheng-Tsai Wu, Hsiang-Hung Chang, Tao-Chih Chang, and Ang-Ying Lin – ITRI; Alvin Lee, Jay Su, and…
Click Here to Read MoreMay 22-25, 2017 Indian Wells, CA [Palm Springs] Booth: 315 CS Mantech: Compound Semiconductor Manufacturing Technology Hyatt Regency Indian Wells Resort & Spa Featured products at CS Mantech: BrewerBOND® 220 Material BrewerBOND® 305 Material BrewerBOND® 510 Material BrewerBOND® 701 Material WaferBOND® HT-10.10 Material WaferBOND® CR-200 Material Schedule a time or ask a question…
Click Here to Read MoreMay 18, 2017 Seoul, Korea Strategic Materials Conference Korea (SMC Korea) 2017 Diamond Room, B1, InterContinental Seoul The 2nd Strategic Materials Conference (SMC) Korea 2017 will be held with a theme of "Scaling Challenges – The Future of Materials". The conference will cover: Material Challenges in Future Memory Market Forecast EUV, Cleaning and Packaging…
Click Here to Read MoreMay 11-12, 2017 Richardson, Texas About CMC: The Critical Materials Council (CMC) Conference is a two day event providing actionable information on materials and supply-chains for current and future semiconductor manufacturing. Conference speakers provide information on critical materials used in HVM fabs and look at manufacturing integration issues associated with new materials needed for…
Click Here to Read MoreApril 25-27, 2017 Penang, Malaysia SEMICON SEA (Southeast Asia) 2017: Semiconductor, Wafer-Level Packaging SPICE Arena Ram is presenting at the Advanced Packaging forum Wednesday, April 26: "Temporary Bonding Technologies for Advanced Fan-Out Wafer Level Packaging Applications" 16:20-16:45, Mr. Ramachandran K. TRICHUR, Director, Business Development, Brewer Science Inc, USA Schedule a time…
Click Here to Read MoreApril 24-27, 2017 Hsinchu,Taiwan. VLSI-TSA Symposium Ambassador Hotel Hsinchu, Taiwanj The 2017 International Symposium on VLSI Technology, Systems and Applications (2017 VLSI-TSA) will be held on April 24-27, 2017 at the Ambassador Hotel Hsinchu,Taiwan. Organized by Industrial Technology Research Institute (ITRI) and technically co-sponsored by IEEE, VLSI-TSA creates an annual platform for technical exchanges by experts…
Click Here to Read MoreApril 20-21, 2017 Wuxi, China The Advanced Packaging Symposium is hosted and organized by Yole Développement and the National Center for Advanced Packaging (NCAP China). All aspects of Advanced Packaging, including Fan Out Packaging, System in Package, Advanced Substrates, 3D Technology & Embedded Technologies, as well as MEMS & Sensors packaging, RF, and Photonics…
Click Here to Read MoreMarch 28-30, 2017 Munich, Germany Booth: 510 "High-Current Pulse Processing to Improve Stability and Hysterisis in CNT-based Printed Electronic Devices" Dr. Ryan Giedd Session: Functional Materials March 29th, 2017 | 12:30 - 12:50 Room 13b Brewer Science will be showcasing their Inflect™ thermistor, moisture, and flex sensors line at LOPE-C. Schedule a time to meet…
Click Here to Read MoreMarch 12 - 13, 2017 Shanghai, China Shanghai International Convention Center "Molecular Force Modeling of Lithography" Zhimin Zhu, Senior Scientist, Brewer Science, Inc. - Invited speaker. Symposium II: Lithography and Patterning Session VI: Process & Material Meeting Room: 3rd Floor Yellow River Hall Sunday, March 12, 2017 16:55-17.15
Click Here to Read MoreMarch 7-8, 2017 Brussels, Belgium Ulrich Herleb "A Novel Approach To How The World Senses: Highly Sensitive, Real-time Response, Light-weight And Flexible Sensor Systems Tuesday, March 7, 2017 14:50 For more information on Ulrich and the IoT International Conference check out their conference website.
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