Dr. Terry Brewer’s discovery of anti-reflective coatings resulted in a revolution in the global microelectronics industry and ushered in today’s high-speed, lightweight electronic devices.
Learn MoreAdvanced materials for the protection and enhancement of optics, displays, and other microelectronics.
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Learn MoreBrewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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May 8-10, 2018 Raleigh Convention Center Raleigh, North Carolina Description: The Manufacturing & Technology Conference & Expo is hosted by Industry Week and is the only event designed to keep manufacturing decisionmakers at the forefront of a fast-evolving landscape in the new digital era. SPEAKER INFORMATION: Title: Apply Continuous Improvement Methodologies to Improve Yield in…
Click Here to Read MoreMarch 13-15, 2018 Messe München Munich, Germany Booth #: 303 Description: For the second year in a row, Brewer Science will be exhibiting at LOPEC – International Exhibition and Conference for the Printed Electronics Industry in Munich, Germany. As the leading trade fair for printed electronics, LOPEC includes every piece of this emerging technology from…
Click Here to Read MoreMarch 14-16, 2018 Shanghai New International Expo Centre Shanghai, China Booth #: Brewer Science Booth: #2635 Nissan Chemical Booth: #2531 Description: SEMICON China is one of the fastest growing SEMI tradeshow/conference events. You will be able to find Brewer Science in two different locations as we are co-exhibiting with Nissan Chemical as well as having…
Click Here to Read MoreMarch 11-12, 2018 Shanghai New International Expo Centre Shanghai, China Description: Brewer Science will be presenting at this annual semiconductor technology conference in Shanghai. This is the biggest technology conference in China since 2000. Organized by SEMI, IMEC, and IEEE-EDS, it will be held in conjunction with SEMICON China. Products/Business Unit Information: Lithography and WLP…
Click Here to Read MoreFebruary 25 – March 2, 2018 Booth #: 110 San Jose Convention Center San Jose, California Speaker Information: Presenter: Zhimin Zhu Time: Tuesday, February 27th: 10:30AM – 12:10PM Optical Microlithography Session 2: Advanced Process Control Paper #: 10587-5 Title: High-fidelity lithography against stochastic effects Poster: Nicholas L. Brakensiek, Kui Xu, and Daniel Sweat Time:…
Click Here to Read MoreFebruary 12-15, 2018 Hyatt Regency Monterey, California Description: Flex 2018, a SEMI organization event in collaboration with MEMS & Sensors Technical Congress (MSTC) in Monterey, California, will be the place to be for both technical and business representatives for the sensors industry. Brewer Science will discuss and present their latest printed sensor systems technologies…
Click Here to Read MoreJanuary 28-31, 2018 Messe Munchen Munich, Germany Description: ISPO is the world’s leading sports business trade fair. Gathering the major brands, suppliers, and innovators for sports technology into one area for a week creates a unique environment for the next generation of sports technology. Products/Business Unit Information: InFlect™ Sensors [Moisture, Flex, and Temperature] Speaker Information:…
Click Here to Read MoreDecember 13-15, 2017 Booth: 3209 Tokyo, Japan SEMICON Japan: Semiconductor, Wafer-Level Packaging Tokyo, Japan For more information contact us at info@brewerscience.com or fill out the below form: For more information: Conference Website
Click Here to Read MoreDecember 6-9, 2017 Singapore, Grand Copthorne Waterfront Hotel Brewer Science’s Ram Trichur, Business Development Director, to present an invited talk at EPTC: Invited-08: Temporary Bonding Materials for Fan-out Packaging Processes Location: Swallow Room Friday, December 8, 2017 8:30-9:00 am Ram is also moderating the Material and Processing session: Session: S-09, Material and Processing Location: Lyrebird…
Click Here to Read MoreTuesday, December 5, 2017 San Francisco, CA, USA Brewer Science’s Kim Yess, Business Technology Director, Wafer-Level Packaging Materials Division, to discuss The Evolution of Substrate Build-up and Thin Wafer Handling in an invited talk at 3D ASIP: Tuesday, December 5, 2017 SESSION 3 Equipment & Materials 5:00pm-5:20pm Check out the program agenda here. 3D…
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