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Brewer Science earns Zero Waste to Landfill certification for exceptional recycling program

Brewer Science employees already see how little goes to waste in their work environments. Now, they have further proof of that achievement. Click to enlarge   Earlier this year, Brewer Science facilities in Rolla and Vichy earned Zero Waste to Landfill Certification after an in-depth audit confirmed they contribute zero waste to landfills. Brewer Science…

  GreenCircle Certified, company, Covanta Energy, bureau veritas certifications, environmental standards, Zero Waste to Landfill, Recycling Click Here to Read More

Multi-layer: A better solution in manufacturing

When faced with a difficult problem, it’s hard to know which way to go. Technology and semiconductor manufacturing certainly have their fair share of challenges. The biggest one (or at least the most recurring) is that demand for smaller and smaller feature sizes is greater than our ability to manufacture them. There’s always the quick…

  spin on carbon, planarized substrates, hardmask, multi-layer, Lithography Click Here to Read More

Planarization Innovations Help Semiconductors Go Even Smaller and More Complex

Imagine you’ve decided to undertake a home improvement project; you’re going to lay tile in the downstairs powder room. To begin, you remove the old vinyl flooring. Underneath are clumps and channels of dried adhesive atop a concrete slab foundation that looks like a miniature lunar landscape. In order to ensure your tiling project has…

  planarization, semiconductors Click Here to Read More

In a world where you can be anything, Brewer Science chooses to be an environmentally responsible technology leader

The choice to be environmentally responsible began when the company was founded in 1981. The owner of Brewer Science, Dr. Terry Brewer, was focused on creating value for our customers through original technology products in the semiconductor market. As Brewer Science invented new products and technologies and manufactured them, Dr. Brewer continued to instill confidence…

  environment, GreenCircle Certified, company Click Here to Read More

Printed Electronics Market Spurs Industry-Wide Opportunities

The growing use of actionable information in new ways to make better decisions is driving brisk growth in printed electronics (PE) and sensors. According to BCC Research, the global market for sensors should grow from $173.4 billion in 2019 to reach $323.3 billion by 2024 – a compound annual growth rate (CAGR) of 13.3%. Where…

  industry 4.0, temperature sensors, Printed Electronics Click Here to Read More

Discover Your Potential with Brewer Science

Uncover endless possibilities with Brewer Science, a leading innovator in technology. Each year, we offer a variety of internships, co-ops and post-doc opportunities to those seeking a career in technology. Opportunities range from traditional science, technology, engineering and math (STEM) programs to business development and purchasing, to name a few. “Brewer Science is not only…

  brewer science, Internships, Potential Click Here to Read More

Diversity Breeds Innovation, and We’ll Showcase Both at IMAPS

  Since our inception, Brewer Science has been strongly committed to cultivating diversity. And we do so for one primary reason: a broad range of backgrounds leads to better ideas and more innovation. But diversity in and of itself isn’t enough; we seek out truly unique talent that will bring the right mix of education,…

  IMAPS, Innovation, Rama Puligadda Click Here to Read More

Thin-wafer handling: Spin chuck designs for thinned substrates

Thin-wafer processing trends Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these fragile materials is paramount and requires specially designed spin chucks and thin-wafer handling techniques. The substrates are made of a wide array of materials, and some of the more popular ones…

  Wafer-Level packaging, thin wafer handling, 3D packaging, spin coat, LED manufacturing Click Here to Read More

Thermal slide debonding for temporary bonding processes (Part 3 of 3)

Thermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage originate during upstream bonding material coating, curing, bonding, and thinning processes. Moreover, only thermal separation tools that are highly precise and highly accurate will consistently…

  3D packaging, Wafer-Level packaging, debonder, thin wafer handling, spincoat Click Here to Read More

Thermal slide debonding for temporary bonding processes (Part 2 of 3)

In addition to precisely controlling application of the materials that enable wafer bonding, a solvent-enriched sealed spin chamber contributes to process integrity. One of the most critical variables in achieving optimal uniformities at the desired target thickness is airflow dynamics. Ideal conditions are created in a sealed chamber with a prewet solvent nozzle, a backside…

  Wafer-Level packaging Click Here to Read More
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