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Multilayer technology from Brewer Science has allowed the industry to continue to push the limits of advanced lithography well into the future. Our experts explain why it was needed and how it eventually became the industry standard for leading-edge semiconductor manufacturing.
Click Here to Read MoreProTEK® Materials Highly oleophobic and hydrophobic transparent scratch-resistant coating.
Click Here to Read MoreWhy do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and packaging steps. Thinning the wafers before the chips are packaged allows for thinner electronic devices and overall better performance Check out our temporary bonding materials…
Click Here to Read MoreWhat is "Fan-out Wafer-Level Packaging"? Fan-out wafer-level packaging (FOWLP) has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and ease of integration using conventional wafer fab equipment. In this video, Ram Trichur describes a typical FOWLP process flow and the challenge of handling the…
Click Here to Read MoreFebruary 15- 17, 2017 Tokyo, Japan Brewer Science is co-exhibiting with OE-A (Organic and Printed Electronics Association). Booth: 6B-28 Conference Website
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