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May 11-12, 2017 Richardson, Texas About CMC: The Critical Materials Council (CMC) Conference is a two day event providing actionable information on materials and supply-chains for current and future semiconductor manufacturing. Conference speakers provide information on critical materials used in HVM fabs and look at manufacturing integration issues associated with new materials needed for…
Click Here to Read MoreApril 19. 2017 – Rolla & Vichy, MO – Brewer Science is pleased to announce the achievement of Zero Waste to Landfill Certification for the second consecutive year. GreenCircle Certified, LLC (GreenCircle), has completed extensive audits to verify that the Rolla and Vichy Brewer Science manufacturing locations contribute zero waste to landfills. The certification is…
Click Here to Read MoreApril 25-27, 2017 Penang, Malaysia SEMICON SEA (Southeast Asia) 2017: Semiconductor, Wafer-Level Packaging SPICE Arena Ram is presenting at the Advanced Packaging forum Wednesday, April 26: "Temporary Bonding Technologies for Advanced Fan-Out Wafer Level Packaging Applications" 16:20-16:45, Mr. Ramachandran K. TRICHUR, Director, Business Development, Brewer Science Inc, USA Schedule a time…
Click Here to Read MoreApril 17, 2017 – Wuxi, China– Brewer Science invites you to join us April 21 for the Advanced Packaging & System Integration Technology Symposium in Wuxi, China. Organized by Yole Développement and the National Center for Advanced Packaging (NCAP China), this event will focus on the field of advanced packaging and include the newest developments…
Click Here to Read MoreApril 24-27, 2017 Hsinchu,Taiwan. VLSI-TSA Symposium Ambassador Hotel Hsinchu, Taiwanj The 2017 International Symposium on VLSI Technology, Systems and Applications (2017 VLSI-TSA) will be held on April 24-27, 2017 at the Ambassador Hotel Hsinchu,Taiwan. Organized by Industrial Technology Research Institute (ITRI) and technically co-sponsored by IEEE, VLSI-TSA creates an annual platform for technical exchanges by experts…
Click Here to Read MoreApril 20-21, 2017 Wuxi, China The Advanced Packaging Symposium is hosted and organized by Yole Développement and the National Center for Advanced Packaging (NCAP China). All aspects of Advanced Packaging, including Fan Out Packaging, System in Package, Advanced Substrates, 3D Technology & Embedded Technologies, as well as MEMS & Sensors packaging, RF, and Photonics…
Click Here to Read MoreMarch 12 - 13, 2017 Shanghai, China Shanghai International Convention Center "Molecular Force Modeling of Lithography" Zhimin Zhu, Senior Scientist, Brewer Science, Inc. - Invited speaker. Symposium II: Lithography and Patterning Session VI: Process & Material Meeting Room: 3rd Floor Yellow River Hall Sunday, March 12, 2017 16:55-17.15
Click Here to Read MoreUnderstanding Panel-Level Processing Ram Trichur explains how the transition from conventional wafers to large panels can generate significant cost savings for fan-out wafer-level packaging, and how these large, thin panels pose new challenges for handling and processing. Learn more about our Wafer-Level Packaging developments here.
Click Here to Read MoreBrewer Science Inflect™ Flex Sensor InFlect™ flex sensors utilize our revolutionary carbon-based nanotechnology to deliver a highly sensitive and real-time response to varying angles of deflection.
Click Here to Read MoreFebruary 10, 2017 – San Jose, CA – Brewer Science invites you to join us February 26 through March 2 at SPIE Advanced Lithography in San Jose, CA, as we showcase original technology products created and manufactured at Brewer Science. Attendees will have the opportunity to learn more about the Brewer Science suite of lithography…
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