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Temporary Bonding and the Importance of Thermal Stability

Noted author and futurist Ray Kurzweil wrote back in 2001, "We won’t experience 100 years of progress in the 21st century — it will be more like 20,000 years of progress. . . ." From the invention of the first integrated circuit in 1958, technology has evolved at an unbelievable rate, and, as Kurzweil suggests, that won't…

  Wafer-Level packaging, Temporary Bonding, Ray Kurzweil, Thermal Stability Click Here to Read More

Futuristic Approach with Directed Self-Assembly

Now that Brewer Science is leading the charge in improving directed self-assembly (DSA) technology, products such as semiconductors, computer hard drives, and drug therapies can benefit from new manufacturing methods that can make complex structures as small as 7 nanometers. The technology allows for higher product volumes and lower costs than in the past, all…

  Directed Self-Assembly, DSA, semiconductors, nano technologies Click Here to Read More

3-D Stacking and the Future of Integrated Circuits

In the early 1970s, Intel co-founder Gordon E. Moore coined the famous Moore's Law, predicting that the number of transistors in integrated circuits (and by extension, processing power) would double each year from then on. Though more of an observational musing than a physical law, it has been remarkably accurate ever since. The principle of Moore's…

  silicon wafers, Integrated Circuits, 3-D Stacking Click Here to Read More

Where is the spin-coating industry headed?

We sat down with our engineers to get their insights on where the spin-coating industry is headed. We were met with an overwhelming response identifying the need for data streaming in real time. Although the spin-coating process is considered to be very efficient, there is always room for improvement. Real-time data monitoring and process transparency…

  cee, spin coaters, Wafer-Level packaging, processing equipment Click Here to Read More

Brewer Science continues push toward zero-landfill status

Here at Brewer Science, we are striving to reach zero-landfill status. Our efforts in environmental responsibility include our mini-bin recycling program and our installation of efficient water and electrical fixtures. Our latest environmentally responsible venture involves a large metal container in our parking lot – a trash compactor we’ve affectionately named Big Blue. This large,…

  Environmental, Zero-Landfill, company, Convanta, energy-from-waste, EfW Click Here to Read More

Former Guardsman keeps Brewer Science materials always ready"

If Brewer Science production facilities are stocked with all the chemicals and equipment employees need to achieve success, they probably have Ryan Buschjost to thank. And if his coworkers appreciate their personal freedoms, they could also give the former National Guardsman a nod. The graduate of Missouri University of Science & Technology (back then it…

  company, National Guardsman, process engineer, chemical engineering Click Here to Read More

Embedded Wafer-Level Ball Grid Array

The terms "quantity" and "quality" are often discussed in "either/or" scenarios. On one side, you get a lot of something. On the other side, you get the best of something else. In these scenarios, you can't have both, at least not at the same time. In the semiconductor industry, there is constant innovation and limit…

  3D Stacking, eWLB, embedded wafer-level, debonding, grid array, Wafer-Level packaging Click Here to Read More

Asking the Right Questions: The Future of Carbon Nanotubes

Famous anthropologist Claude Levi-Strauss said that the scientist is not one who gives the right answers, but one who asks the right questions. If this is the case (and we whole-heartedly believe it is), the future looks bright. Recently, an inquisitive student was researching Alzheimer’s disease and some possible ways carbon nanotubes (CNTs) could help…

  other, cnt, carbon nanotubes, soluble, insoluble Click Here to Read More

Wafer-Level Packaging and the Mobile Revolution

Back in September and this past March, Apple held its biannual Special Events. These events are meant to introduce new products and features, and they happen quite regularly. These two recent events, however, seemed to leave something out: computers. September’s presentation was over two hours long and didn’t once mention the flagship devices that put…

  3d, Wafer-Level packaging, FOWLP, Integrated Circuits, 2d Click Here to Read More

Solutions to Manufacturing's Water Problem

  You show me someone who lives in a low-lying area and I’ll show you someone who understands how damaging water can be. Water is essential to all life here on earth. The planet is mostly water. Our bodies are mostly water. Life as we know it would not exist were it not for the…

  moisture sensors, inflect sensors, wafer problems, Sensors, Wafer-Level packaging Click Here to Read More
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