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Environmental Awareness: How to Build a Culture of Environmental Responsibility

Protecting our environment and conserving resources are essential to running a successful and mindful business, but how do you make this part of your organization’s mission and vision? The key to building a culture of environmental responsibility begins with the commitment and support of leadership and engagement of all employees.  Engaged employees are a key…

  Sustainability Click Here to Read More

Sacrificial Laser Release Materials for RDL-First Fan-out Packaging

 Article published in Chip Scale review's March - April 2018; Volume 22, Number 2 Issue The semiconductor industry is in a new age where device scaling will not continue to provide the cost reductions or performance improvements at a similar rate to past years when Moore’s law was the guiding principle for IC scaling. The…

  thermal slide debonding, Fan-Out Wafer Level Packaging, chemical stability, laser debonding, RDL-first Click Here to Read More

Geothermal Power Offers Key Benefits for Sustainable Manufacturing

According to the U.S. Energy Information Administration (EIA), U.S. production and consumption of non-hydro renewable energy sources (i.e., biofuels, biomass, geothermal, solar, wind) set new records in the first half of 2018. Of these sources, geothermal, while still relatively nascent in its implementation, holds great promise. Integrating geothermal systems for heating and cooling into a…

  Geothermal, fossil fuel, Sustainability Click Here to Read More

From the Bottom Up: Making More Room with Selective Surface Modification

Richard Feynman, who won the Nobel Prize in Physics in 1965, gave a famous lecture titled “There's Plenty of Room at the Bottom.” Today’s microelectronics process engineer, in the context of conventional top down lithography, would find it difficult to accept this statement without a long list of caveats. Aggressive scaling demands for newer generations…

  Lithography, DSA, Selective Surface Modification Click Here to Read More

How can glass survive rigorous back end processes?

Brewer Science is headed to the CS ManTech conference May 18 through 21!  CS ManTech is a respected organization focused on providing a forum for members of the compound semiconductor community to exchange and discuss new ideas. At this year's conference, we’re excited to share our findings regarding the ability of glass to be used…

  back-end processes, CTE, CSAM, CS Mantech, Wafer-Level packaging, Corning, temporary bonding materials Click Here to Read More

Futuristic Approach with Directed Self-Assembly

Now that Brewer Science is leading the charge in improving directed self-assembly (DSA) technology, products such as semiconductors, computer hard drives, and drug therapies can benefit from new manufacturing methods that can make complex structures as small as 7 nanometers. The technology allows for higher product volumes and lower costs than in the past, all…

  nano technologies, Directed Self-Assembly, DSA, semiconductors Click Here to Read More

3-D Stacking and the Future of Integrated Circuits

In the early 1970s, Intel co-founder Gordon E. Moore coined the famous Moore's Law, predicting that the number of transistors in integrated circuits (and by extension, processing power) would double each year from then on. Though more of an observational musing than a physical law, it has been remarkably accurate ever since. The principle of Moore's…

  Integrated Circuits, 3-D Stacking, silicon wafers Click Here to Read More

Temporary Bonding and the Importance of Thermal Stability

Noted author and futurist Ray Kurzweil wrote back in 2001, "We won’t experience 100 years of progress in the 21st century — it will be more like 20,000 years of progress. . . ." From the invention of the first integrated circuit in 1958, technology has evolved at an unbelievable rate, and, as Kurzweil suggests, that won't…

  Ray Kurzweil, Thermal Stability, Wafer-Level packaging, Temporary Bonding Click Here to Read More

Where is the spin-coating industry headed?

We sat down with our engineers to get their insights on where the spin-coating industry is headed. We were met with an overwhelming response identifying the need for data streaming in real time. Although the spin-coating process is considered to be very efficient, there is always room for improvement. Real-time data monitoring and process transparency…

  Wafer-Level packaging, processing equipment, cee, spin coaters Click Here to Read More

Brewer Science continues push toward zero-landfill status

Here at Brewer Science, we are striving to reach zero-landfill status. Our efforts in environmental responsibility include our mini-bin recycling program and our installation of efficient water and electrical fixtures. Our latest environmentally responsible venture involves a large metal container in our parking lot – a trash compactor we’ve affectionately named Big Blue. This large,…

  company, Convanta, energy-from-waste, EfW, Environmental, Zero-Landfill Click Here to Read More
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