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Since our inception, Brewer Science has been strongly committed to cultivating diversity. And we do so for one primary reason: a broad range of backgrounds leads to better ideas and more innovation. But diversity in and of itself isn’t enough; we seek out truly unique talent that will bring the right mix of education,…
Click Here to Read MoreDeveloping photosensitive film layers to produce features of targeted sizes is a critical process step within any photolithography application. Application engineers have created several processes for performing this step with tank immersion (that is, a bath) and/or several adaptations of spin developing a single wafer to make patterns of features based on film areas of…
Click Here to Read MoreAs part of the manufacturing and innovation industry, Brewer Science relies on the growth of STEM education, jobs, and overall interest in the subjects to maintain our business model in the U.S. Our president and founder, Dr. Terry Brewer, addresses three main initiatives to help ensure the growth of STEM: Expand STEM opportunities in the…
Click Here to Read MoreThermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage originate during upstream bonding material coating, curing, bonding, and thinning processes. Moreover, only thermal separation tools that are highly precise and highly accurate will consistently…
Click Here to Read MoreIn addition to precisely controlling application of the materials that enable wafer bonding, a solvent-enriched sealed spin chamber contributes to process integrity. One of the most critical variables in achieving optimal uniformities at the desired target thickness is airflow dynamics. Ideal conditions are created in a sealed chamber with a prewet solvent nozzle, a backside…
Click Here to Read MoreThe microelectronics industry is rapidly migrating to fabricating 3-D wafer stacking interconnects using through-silicon via (TSV) technology. Major market segments seeking to benefit from TSV technology include advanced packaging for memory/logic, light-emitting diodes (LEDs), and compound semiconductor (III-V) high-power radio-frequency (RF) devices. In this cutting-edge technology, fragile device substrates are bonded to carrier substrates with…
Click Here to Read MoreThe Internet of Things (IoT) includes a number of different applications throughout a wide assortment of industries. In our first breakdown of applications within the IoT, we discussed how Brewer Science creates materials for sensors and MEMS devices essential to the development of IoT applications. Now we’ll take a look at our involvement with control…
Click Here to Read MoreIn recognition of its progress with temporary bonding and thin wafer handling, Brewer Science was featured in the November/December issue of Chip Scale Review. The feature discusses the company’s use of wafer-level packaging (WLP) technologies in semiconductor segments, including fan-out WLP (FOWLP); fan-in wafer-level chip-scale package (FI-WLCSP); 3-D FOWLP; 2.5-D integration with interposer technology; and…
Click Here to Read MoreIn its constant quest to innovate, Brewer Science is continually on the cutting edge of what is next. We are currently combining directed self-assembly (DSA) and lithography to achieve sub–10 nm nanostructures. DSA uses block copolymers to generate arrays of self-assembled shapes such as lines or cylinders; the spatial arrangements of the resulting features can…
Click Here to Read MoreThe Internet of Things (IoT) has made substantial strides since first being envisioned in 1999, having moved beyond machine-to-machine communications, toward impacting a variety of industries with “smart” devices. Nearly 26 billion devices will be connected to the IoT by 2020, according to technology research firm Gartner, Inc., and the majority of these devices fit…
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