Dr. Terry Brewer’s discovery of anti-reflective coatings resulted in a revolution in the global microelectronics industry and ushered in today’s high-speed, lightweight electronic devices.
Learn MoreAdvanced materials for the protection and enhancement of optics, displays, and other microelectronics.
Learn MoreOur line of products stretches across the whole spectrum of lithography wavelengths and is the most comprehensive product lineup in the industry.
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Learn MoreBrewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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Jim introduces us to the concept of FMEA, Failure Modes and Effect Analysis, and the process of analyzing potential failure points and adjusting your product or process design to mitigate risks. Brewer Science Virtual Learning Lab is a series of short videos with experts introducing STEAM and other educational topics.
Click Here to Read MoreWho should you share your birth date with? Who should know your email password? Becky introduces us to three types of information, examples of each, and how you should treat each type. Brewer Science Virtual Learning Lab is a series of short videos with experts introducing STEAM and other educational topics. https://www.youtube.com/watch?v=jCCLd1j0qWg&t=1s
Click Here to Read MoreOctober 22 & 23 CMC Conference preceded by CMC Meeting at Intel on October 20-21 Featuring Keynote: Bruce Tufts, VP Technology & Manufacturing Group, Director, Fab Materials, Intel Corp with presentations from industry leaders focused on: “The Current and Future Challenges of Critical Materials For Semiconductor Manufacturing” Learn more on the conference website
Click Here to Read MoreBridging the Boundaries: Wafer, Panel and Beyond October 13 - 15, 2020 DoubleTree by Hilton San Jose San Jose, California, USA The SMTA and Chip Scale Review are pleased to announce plans for the 17th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being…
Click Here to Read MoreThe Next Wave of Sensorization: Solving Our Shared Challenges Industry economic, business updates will be covered from different aspects of the ecosystem, together with forward-looking strategic and technology trends. The opportunities and challenges brought about by key technologies and markets in the areas of medical, AR, VR, motion capture, environmental, food/agriculture, ultrasonic applications, and wearable…
Click Here to Read MoreSEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, the academia, and research institutions. Witnessing enormous business collaboration, SEMICON Taiwan still stays true to its missions― Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration and continues…
Click Here to Read MoreJonathan Jeauneau and Douglas Guerrero will be presenting research at the 20th annual FujiFilm Advanced Lithography Workshop Hybrid Event. Join us to explore the latest innovations in the semiconductor industry. Get inspired, get connected with lectures from our guest speakers. Meet the semiconductor community and network while joining our famous hands on workshop. Don't miss…
Click Here to Read MoreMaintaining a culture of connection with limited in-person interactions is a high priority at Brewer Science. Amy Skyles, Learning & Development Manager, shares how we have addressed and adapted to this situation in 'How Brewer Science is Maintaining Connection During Times of Change.' Watch the Webinar
Click Here to Read MoreRachel Jung, Director of PMO at Brewer Science participated in the 'Digital TrailBlazer,' a 5-part virtual roundtable series hosted by YASH Technologies. Hear from Rachel and other industry leaders in the recorded webinars. Watch the Webinars
Click Here to Read MoreBrewer Science participated in the 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). Xiao Liu, Senior Program Manager at Brewer Science, presented 'Introduction of a New Carrier System for Collective Die-To-Wafer Hybrid Bonding and Laser-Assisted Die Transfer' in Session 7: Advances in Packaging at Wafer/Panel Level
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