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Brewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE

Brewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE Achieving High-Volume, Zero-Defect Quality Polymer Purification   San Diego, CA – October 23, 2024 – Brewer Science, Inc., a high-volume manufacturer of ultrapure semiconductor materials, is presenting their latest innovation in polymer purification at the AIChE Conference from October 27th through 31st. Traditional Batch…

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Five Questions to Ask When Selecting a Temporary Bonding and Debonding System

Five Questions to Ask When Selecting a Temporary Bonding and Debonding System Thin-wafer handling requires strategic material selection   High-bandwidth memory blocks (HBM) memory, microprocessors, field-programmable gate arrays (FPGA), AI accelerators, and other devices used in advanced system-level packaging all rely on temporary bonding and debonding systems to shrink their footprint. Understanding which properties play…

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Brewer Science Achieves Certified B Corporation Recertification

Brewer Science Achieves Certified B Corporation™ Recertification Certified B Corporation™ recertification and 2024 Impact Report accredit commitment to positive impact.   Rolla, MO – July 31, 2024 – Brewer Science, Inc., a global leader in semiconductor innovation, is thrilled to announce its recertification as a Certified B Corporation™. This achievement underscores Brewer Science's steadfast commitment…

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Brewer Science Named 2024 National Top Workplace in Manufacturing Industry

Brewer Science Named 2024 National Top Workplace in Manufacturing Industry Work-life balance and supportive managers among top culture drivers identified   Rolla, MO – July 15, 2024 - Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, has been named a 2024 National Top…

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Collaboration and Persistence: Two Critical Components of Technology Innovation

Collaboration and Persistence: Two Critical Components of Technology Innovation How Brewer Science's R&D Shapes the Future of Technology by Challenging Today’s Assumptions   In the dynamic realm of technology, pioneers often face skepticism before their innovations are embraced. Imagine the 1980s, a time when the semiconductor industry teetered on the brink of transformation. Amidst uncertainty,…

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Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, High-Performance Computing

Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, High-Performance Computing Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing.   Taipei, Taiwan – August 28, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, shares its expertise on the…

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Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, High-Performance Computing

Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, High-Performance Computing Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing.   Taipei, Taiwan – August 28, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, shares its expertise on the…

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Materials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024

Materials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024 Experience higher integration density and improved performance through hybrid bonding techniques.   Boston, MA –  September 24, 2024 – Brewer Science, Inc., a pioneer in temporary bonding and   materials for the semiconductor industry, is presenting Materials for Hybrid Bonding at IMAPS Symposium 2024…

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Materials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024

Materials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024 Experience higher integration density and improved performance through hybrid bonding techniques.   Boston, MA –  September 24, 2024 – Brewer Science, Inc., a pioneer in temporary bonding and   materials for the semiconductor industry, is presenting Materials for Hybrid Bonding at IMAPS Symposium 2024…

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Implementation of New Materials and Printed Electronics for Monitoring the Environment Presented at TechBlick in Boston

Implementation of New Materials and Printed Electronics for Monitoring the Environment Presented at TechBlick in Boston Cost-effective, reliable, and scalable environmental monitoring solutions require Additively Manufactured Electronics (AME).   Boston, MA – June 10,  2024 – Brewer Science, Inc., a pioneer in printed electronics and smart device technology, will be presenting Implementation of New Materials…

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