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“Achieve fulfillment” is a part of Brewer Science’s mission statement, but what does it mean, and how does it impact our company culture? When employees are encouraged to support their communities through volunteering, giving, or outreach, this mindset motivates higher regard for the impact they have not just on their own lives but the lives…
Click Here to Read MoreSPIE Advanced Lithography + Patterning 2025 An integration engineering approach to material design and development presented by James Lamb; Development of underlayers for MOR sensitivity improvement presented by Si Li (Elly) Event: SPIE Advanced Lithography + Patterning 2025 Location: San Jose, California Conference Center: San Jose McEnery Convention Center Keynote Presentation: An integration…
Click Here to Read MoreSPIE AR VR MR 2025 Materials for next-generation optical devices with high transmission presented by Reuben Chacko Event: SPIE AR VR MR 2025 Location: San Francisco, California Conference Center: The Moscone Center West Presentation: Materials for next-generation optical devices with high transmission Speaker: Reuben Chacko, PhD Date: January 27 – 29, 2025 Time:…
Click Here to Read MoreHybrid Bonding Symposium hosted by IEEE Materials for Hybrid Bonding presented by Andrea Chacko Event: Hybrid Bonding Symposium hosted by IEEE Location: Silicon Valley, California Conference Center: SEMI World Headquarters 673 South Milpitas Blvd, Milpitas, CA USA Presentation: Materials for Hybrid Bonding Speaker: Andrea Chacko, PhD Date: January 16 – 17, 2025 Time:…
Click Here to Read MoreInnovation in hybrid bonding and laser debonding presented at EPTC in Singapore 3D Packaging and Thin Wafer Processing Research Co-Presented by Brewer Science Singapore – December 2, 2024 – Brewer Science, Inc., an industry leader in advanced packaging materials for semiconductor manufacturing, will present its latest research developing the next-generation of 3D packaging materials…
Click Here to Read MoreDougal Guerrero, Ph.D. will present "New materials towards sustainable manufacturing" at The Lithography Workshop 2024 in San Deigo, California on November 5th at 11:50AM PST.
Click Here to Read MoreMulti-Tier Die Stacking Enables Efficient Manufacturing Achieve higher integration density with collective die-to-wafer bonding Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die stacking and hybrid bonding, enable increased integration density, therefore improving yield of high-quality devices. However, these…
Click Here to Read MoreBrewer Science Elevates Two Corporate Leaders to Chief Executive Role Corporate leadership developments to drive projected growth and innovation Rolla, MO – October 10, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials used to advance next-generation computing technologies, is elevating two senior leaders to co-chief executive. This change will…
Click Here to Read MoreBrewer Science presents Materials Innovation for Additive Electronics at InterPACK 2024 Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing San Jose, California – October 2, 2024 – Brewer Science, Inc., a global leader in advancing innovative materials needed for additive electronics, is presenting Building Circuits from the Ground Up:…
Click Here to Read MoreBrewer Science Elevates Veteran Leader and Welcomes New Market Strategy Officer to Propel Future Growth in Semiconductor Industry Corporate leadership developments to drive projected growth and innovation Rolla, MO – September 11, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials used to advance next-generation computing technologies, is elevating…
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