Brewer Science's gapfill and planarizing materials are designed to planarize a multitude of incoming substrates with tight pitch and high-aspect-ratio topographies. Our materials are designed to be compatible with common upstream and downstream processes and materials to enable a wide spectrum of integration options for our customers.
The planarizing carbon layer, or spin-on-carbon (SOC) layer, is an essential material to planarize incoming substrate and provide the desired optical control and etch transfers. Brewer Science’s OptiStack® SOC110/120 materials are robust, industry-proven SOC products that fulfill most gapfilling, planarizing, and etch transfer needs. Recently, Brewer Science introduced OptiStack® SOC410/450 materials, which can be used at 400-550°C as a high-temperature SOC (HT-SOC). They are designed to be compatible with chemical vapor deposition (CVD) processes to form a multilayer stack for pattern transfer. The high carbon content and hardness, resulting from a high-temperature bake, help control line wiggling during etch transfer of high-resolution features and also allow these materials to be used as a carbon mandrel for self-aligned double patterning (SADP).
The OptiStack® PL200 materials are spin-on, silicon-containing gapfill materials designed to provide excellent gapfill for <10-nm trench and via structures commonly found in today’s advanced semiconductor manufacturing processes. These materials are designed to have low shrink in O2 but be easily removed with an SC1 clean even after high-temperature processing.
Brewer Science® GF 110 material is designed to gapfill and planarize very deep structures that can be found in analog, power, photonics, and 3D memory devices. We offer a variety of viscosity options for coating thickness up to 3 µm.
Gapfilling and Planarization Materials