Baron Huang, Mei Dong, Shelly Fowler, Andrea Chacko, and Rama Puligadda contributed to Chip Scale Review with a discussion of Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material.
Downscaling is a never-ending task for the semiconductor industry to meet the ever-increasing electronic system demands for higher performance and functionality, smaller system form factor, and lower power consumption and cost.
Read in detail the analysis the team brings to hybrid bonding using a photosensitive permanent bonding material. The full article can be accessed on the Chip Scale Review page.
ChipScale_Mar-Apr_2022_Brewer Science
