May 28-31, 2019
Las Vegas, Nevada
May 28-31, 2019
The Cosmopolitan of Las Vegas
Las Vegas, Nevada
The Electronic Components and Technology Conference (ECTC) is an international event that brings together the best in packaging, components, and microelectronic systems in an environment of cooperation and technical exchange.
If you’re looking to gain insight into the industry, make sure to stop by the following Brewer Science sessions to hear from our top leaders:
Presentations:
Session 37: Interactive Presentations I
May 29, 2019 | 9:00 a.m.-11:00 a.m.
Title: A Versatile Fan-Out Infrastructure Based on Die-Stencil Substrate Promoted by Advanced Multifunctional Temporary Bonding Material
Speaker: Xiao Liu
Session 8: Material and Process Trends in FOWLP & PLP Sessions
May 29, 2019 | 2:20 p.m.
Title: Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-Up
(Joint paper between Brewer Science and IMEC)
Speaker: Arnita Podpod
Session 8: Material and Process Trends in FOWLP & PLP Sessions
May 29, 2019 | 4:45 p.m.
Title: Investigation and Methods Using Various Release and Thermoplastic Bonding Materials to Reduce Die Shift and Wafer Warpage for eWLB Chip-First Processes
Speaker: Shelly Fowler
Session Chair:
Session 22: Advanced Substrates and Interconnect Technology
May 30, 2019 | 1:39 p.m.-5:10 p.m.
Session Co-Chairs:
Kimberly Yess | Brewer Science
Mikel Miller | EMD Performance Materials
Brewer Science is excited to attend and present at ECTC this year. We have been using our materials’ expertise in the semiconductor industry to change the way the world looks at packaging for over 10 years. Learn more about our Wafer-Level program and products here.
For information on ECTC, visit their website here.
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