SEMICON SEA (Southeast Asia) 2017

April 25-27, 2017
Penang, Malaysia

 

 

SEMICON SEA (Southeast Asia) 2017: Semiconductor, Wafer-Level Packaging
SPICE Arena

 

Ram is presenting at the Advanced Packaging forum Wednesday, April 26:

“Temporary Bonding Technologies for Advanced Fan-Out Wafer Level Packaging Applications”

16:20-16:45, Mr. Ramachandran K. TRICHUR, Director, Business Development, Brewer Science Inc, USA

 

Schedule a time to meet at the conference or ask a question about a featured product:

For more information: Conference Website

  Events,  2017